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AIM to Participate at productronica China 2020
June 30, 2020 | AIM SolderEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce their participation at productronica China, scheduled to take place July 3-5, 2020 at Shanghai New International Expo Centre in Shanghai, China. AIM will highlight their NC273LT low temperature solder paste for bismuth bearing alloys, RX18 and CX18 no clean flux cored solder wire along with their full line of solder assembly materials.
AIM's NC273LT low temperature solder paste provides assemblers another tool to meet the changing needs of an evolving PCB assembly market. With peak reflow temperatures below 170°C, NC273LT reduces component and substrate warpage, reduces thermal exposure and saves energy. NC273LT paste improves the wetting performance of bismuth alloys to RoHS compliant plating and surface finishes. NC273LT provides long stencil life, excellent transfer efficiencies and minimizes solder balling common to high bismuth alloys. When thermal exposure during the assembly process is a limitation, NC273LT is an excellent RoHS compliant replacement.
AIM's RX18 and CX18 continue to achieve unprecedented customer acceptance. Engineered for automated/robotic selective soldering, RX18 promotes thermal transfer, fast wetting and reduces voids/skips. Additionally, RX18 is extends solder iron tip life and leaves minimal flux residue. CX18 is an operator friendly, low odor/smoke formula, and speeds soldering performance leaving a clear, electrically safe residue that does not require removal. Further throughput and reliability gains can be realized when CX18 and RX18 are combined with AIM's REL61™ and REL22™ alloys. REL22 improves product survival in extreme thermal exposure operating environments such as under-hood automotive, avionics/aerospace and LED lighting. REL61 is ideally suited for industries which require a cost effective alternative to SAC305 with no loss of processing performance or durability.
Along with these products, AIM will also showcase its full line of advanced solder materials, including solder paste, liquid flux and solder alloys. To discover all of AIM’s products and services, visit the company at productronica China at the National Exhibition and Convention Center (Shanghai) in hall 5.1 booth A206 and speak with one of AIM’s knowledgeable staff members.
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