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Just Ask Happy: Resin-Filled Vias, Without VoidsSeptember 9, 2020 | I-Connect007 Editorial Team
Estimated reading time: Less than a minute
We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.
Q: What is the best way to resin-fill vias without voids?
A: I have not used this process a lot. In the past, partially filling surface vias with solder mask was sufficient. But now, with via-in-pad and stacked microvias, the filling process must be much more complete. Several machines on the market do this job very adequately and can be seen at the IPC APEX EXPO or SMTA International.
To pose your own question for Happy Holden, take the survey by clicking here.
Indium Corporation is proud to announce the addition of Sales Engineer Meik Fratzel to its European team.
Transition Automation, Inc. recently received a large order for Advanced Holder and Blade Assemblies compatible with DEK printers from Rotec BV in Belgium.
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its new NC259FPA Ultrafine No Clean Solder Paste, which it revealed recently during the Productronica Germany trade show.
Real Time with... productronica 2023: Koh Young Discusses Semiconductor and Advanced Packaging Inspection11/27/2023 | Real Time with...productronica
Koh Young’s Harald Eppinger talks about the company’s technology for the semiconductor and advanced packaging market and how they address the challenges introduced by reflective components and micro solder deposits.
HyRel Technologies Attains ITAR Registration, Reinforcing Leadership in Robotic Solder Component Tinning11/27/2023 | HyRel
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, announces the achievement of International Traffic in Arms Regulations (ITAR) registration.