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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Real Time With…I-Connect007: The App Notes and Fab Notes Roundtable
September 3, 2020 | Andy Shaughnessy, PCB Design007Estimated reading time: 1 minute
Most of our readers are familiar with our Real Time With... video program. For over a decade, our production teams have been a staple at trade shows and conferences around the world, from San Diego to Shanghai, doing on-camera interviews with the industry’s top technologists, managers, and executives.
Now, we've decided to shake things up a bit. Real Time With…I-Connect007 has turned the cameras around to focus on recent issues of our magazines. In this first installment of this new series, we invited four of our recent contributors—Dana Korf, Jen Kolar and Mark Thompson of Monsoon Solutions, and Kelly Dack—to review the June and August issues of Design007 Magazine, which covered app notes and fab notes, respectively.
In this wide-ranging roundtable, we discuss some of the ongoing challenges related to design data and why communication can preclude many of these problems.
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"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
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Element Solutions Reports Record Quarterly Results and Increases 2026 Full Year Guidance
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Molex to Acquire Teramount to Accelerate Scalable Co-Packaged Optics Adoption
04/15/2026 | PRNewswireMolex, a global electronics leader and connectivity innovator, announced an agreement to acquire Teramount Ltd., an Israel-based developer of detachable fiber-to-chip connectivity solutions optimized for high-volume Co-Packaged Optics (CPO) and other silicon photonics applications.
ASMPT Enhances WORKS Monitoring to Boost SMT Production Transparency and Accuracy
04/15/2026 | ASMPTASMPT SMT Solutions, the technology and market leader in integrated hardware and software solutions for electronics manufacturing, presents a new version of WORKS Monitoring.