-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Oops, I Did It Again: Survey Details Most Common Design Errors
December 9, 2020 | Michelle Te, I-Connect007Estimated reading time: 1 minute
We hate to admit it, but even the best of us make mistakes. Such is true with PCB designers and design engineers. We wondered: What are the most common mistakes that PCB designers make?
Since no one likes to admit they make mistakes, the I-Connect007 Research Team sent that very question out in a survey. Sometimes it just feels better to remain anonymous. There’s a little more truth there.
Your responses to the survey, we found, could be divided into three categories: failures/errors, changes/improvements, and time to market. And just for fun, there’s a miscellaneous category, but more on that later.
In what our team categorized as failures/errors, there was a wide range of responses, including “electrical functions wrong,” “part obsolescence,” “noise,” “thermal failures,” “minor design corrections,” and “performance not met.” Others cited errors with engineering, circuit design, schematics, design faults, software issues, and simply, “dumb mistakes.”
Many other respondents recognized the need to make changes and improvements. Some comments included: “Adding new functionality,” “changes in product specification,” “layout improvements,” “dimensional/shape adaptation due to altered design on housing,” “evolving requirements, learning as you go,” “out of sync with mechanical model because of last-minute changes,” “EMV improvements,” “needs for change identified during testing,” and “mechanical changes (enclosures, mounting, etc.).”
Still others responded that errors occur because of time or time-to-market. They listed these conclusions: “Short schedule limits detailed checking,” “new, unproven designs,” “rushing to production,” and “not taking the time to perform analysis of design up front.”
And finally, there were miscellaneous responses that didn’t seem to fit the above. They had to do with PCBA alignment, footprint issues, not fully appreciating mechanical tolerance chain, reducing cost, optimization, manufacturing issues and solder mask, and panelization.
If you’re a designer or work with designers, you likely recognize some of these issues. But what is to be done? In upcoming issues of Design007 Magazine, you’ll read more about these issues along the path to continuous improvement.
If you’d like to comment on a particular design error, please reach out to Editor Andy Shaughnessy and share what works or doesn’t work for you.
The I-Connect007 Research Team is just one component of the I-Connect007 Team, fully committed to the most extensive coverage of the global printed circuit board, assembly and PCB design industry.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.