-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueCounterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
KIC at SMTAI: Solutions for Reflow and Wave Soldering Optimization, Inspection and Traceability
October 5, 2021 | KICEstimated reading time: 1 minute
KIC will exhibit in Booth #3101 at SMTA International, scheduled to take place November 3 - 4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. Along with Reflow Process Inspection (RPI) and Wave Solder Process Inspection (WPI), the KIC team will discuss NPI setup, process optimization for reduced defects, improved OEE, and their complete ecosystem of solutions for thermal processes.
KIC has solutions for challenges such as handling process audits, automating manual profiling and data reporting tasks, MES connectivity, Industry 4.0 implementation, NPI process setup, reducing solder defects (voiding, head in pillow, tombstoning) and more.
Electronics manufacturing today requires automated and real-time process control and traceability. Like SPI and AOI are for optical inspection, inspection of the production reflow temperature profile is a must. Could you imagine a line without SPI or AOI? Make sure you include RPI. Process control, traceability and quality solder joints can be delivered with real-time inspection capabilities and that is what KIC provides (and invented) for your thermal processes. This critical data should be a part of your overall Industry 4.0 smart factory solution to ensure all production through the oven is within specifications and that profile data is readily available for each individual board.
The latest addition to the thermal process inspection family is KIC’s WPI, bringing its award-winning technology and thermal experience to the wave solder process. Wave Process Inspection provides users with automatic profiling – including an industry first dwell time and parallelism measurement for each production board – real-time preheat and wave analytics, automatic SPC charting and more.
KIC’s 45 years of experience in automated process data collection, direct service and support offices in every region, and more than 25,000 systems in the field brings the most reliable, accurate and innovative solutions for electronics manufacturing thermal process tools.
Suggested Items
Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens
10/14/2024 | BransysBransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4
10/03/2024 |Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 3
08/14/2024 | I-Connect007 Editorial TeamChapter 3 of this book delves into the critical aspects of the SMT process, focusing on the reflow oven and automated optical inspection (AOI) machine. Highlighted are the key roles of the line operator, manufacturing engineer, and quality manager in maintaining efficient operations and high-quality PCBAs.
Solderstar to Present Advanced Reflow Profiling Solution at SMTA International 2024
08/08/2024 | SolderStarSolderstar, a leader in innovative profiling solutions for the electronics manufacturing industry, is exhibiting at the SMTA International 2024 conference in Rosemont, Illinois, booth 2838, from October 22-24.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/26/2024 | Nolan Johnson, I-Connect007This week, I’ve been attending Thailand Electronic Circuits Asia 2024. This is the inaugural event, hosted by Thailand Printed Circuit Association (THPCA) in collaboration with the Hong Kong Printed Circuit Association (HKPCA). Thailand has supported a PCB industry for some time—mostly automotive applications—but the China Plus One dynamic has definitely taken root here.