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Don’t Miss Further Discussion of Materials Testing in GEN3 Episode 6 of ‘Predicting Reliability in Electronics’
December 22, 2021 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
In this engaging, 11-part micro webinar series, topic experts Graham Naisbitt and Chris Hunt examine the history of the influences of Electrochemical Migration (ECM) and the evolving use of Surface Insulation Resistance Testing (SIR) that has been developed over the past 25 years by GEN3 and its association with the British National Physical Laboratory. GEN3 and NPL have created the standard that has now been in widespread use around the world since the turn of the millennium.
The sixth episode, “Materials Testing—Process Materials,” can be viewed in under four minutes. Presenters share information on paste vs. flux vs. rework, limitations of standards, hand soldering/rework cautions, and more.
Designed to complement GEN3’s book, The Printed Circuit Assembler’s Guide to...Process Validation, this entire webinar series can be viewed in about an hour and covers a comprehensive range of topics surrounding the four groundbreaking test standards published between 2019 and 2021 that set the scene for Objective Evidence and its widespread influence throughout the world of electronics, whether in the high reliability arena of space, medical, automotive, or general industrial applications.
Visit Predicting Reliability in Electronics and start watching, free, today!
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