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New Book From Isola Highlights Importance of Material Selection
January 14, 2022 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

In The Printed Circuit Designer’s Guide to... High Performance Materials, the latest release from I-007eBooks, readers will learn how to overcome challenges associated with choosing the right material for their specific application. Author Michael Gay of Isola provides a clearer picture of what to know when determining which material is the most desirable for which products.
Key questions answered:
- Why is PPO resin better than epoxy resin for electrical performance?
- Why could flat glass fabrics reduce the skew and ease for laser drilling?
- Why is very low-profile copper foil preferred for high-speed applications?
- What is the impact of raw materials on data rate and signal integrity testing?
PCB materials and DFM expert Mark Thompson says, “I love this book, particularly the sections on the effects of the glass weave, the history of laminate, and the difference between Dk and effective Dk. I highly recommend it for any designer or engineer looking to better understand laminate.”
Download your free copy today.
You can view other titles in our full library here. The Printed Circuit Designer’s Guide to… series is specifically dedicated to educating the circuit board design sector and serves as a valuable resource for those seeking the most relevant information available.
We hope you enjoy The Printed Circuit Designer’s Guide to… High Performance Materials.
Suggested Items
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Trouble in Your Tank: Organic Addition Agents in Electrolytic Copper Plating
04/15/2025 | Michael Carano -- Column: Trouble in Your TankThere are numerous factors at play in the science of electroplating or, as most often called, electrolytic plating. One critical element is the use of organic addition agents and their role in copper plating. The function and use of these chemical compounds will be explored in more detail.
IDTechEx Highlights Recyclable Materials for PCBs
04/10/2025 | IDTechExConventional printed circuit board (PCB) manufacturing is wasteful, harmful to the environment and energy intensive. This can be mitigated by the implementation of new recyclable materials and technologies, which have the potential to revolutionize electronics manufacturing.