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I-Connect007 Releases New Guide Expanding on Qnity’s Engineering What’s Next Podcast Series

10/26/2026 |
I-Connect007 is pleased to announce the release of Engineering What’s Next: A Companion Guide to Qnity’s Advanced Electronics Podcast Series, a new publication that expands on the insights shared in the six-part series. As artificial intelligence, advanced packaging, and next-generation electronics continue to transform the industry, engineers face increasingly complex challenges in performance, reliability, thermal management, and sustainability. This guide explores why advanced materials—and the expertise to integrate them into practical solutions—are essential to meeting these demands.

It’s Only Common Sense: Every Salesperson Must Become a Teacher

10/26/2026 | Dan Beaulieu -- Column: It's Only Common Sense
Customers do not need more sales pitches. They need more clarity.  They are trying to navigate material shortages, component constraints, changing tariffs, longer lead times, new technologies, geopolitical uncertainty, and the enormous demands AI is placing on the electronics supply chain. Every day brings another warning, and much of the information is contradictory, exaggerated, or so technical that it creates more confusion than understanding.

ICT 2026 Annual Symposium Review (Part 1): What Lies Ahead?

10/22/2026 | Pete Starkey, FInstCT
It was a misty autumn morning on the outskirts of Coventry in the Midlands of England for the 2026 Annual Symposium of the Institute of Circuit Technology. ICT technical director Alun Morgan welcomed delegates and remarked upon the excellent attendance. Although there were plenty of familiar faces in the audience, an encouraging number of hands were raised when Morgan enquired who was there for the first time. Remarking that although the Institute had seen a lot of changes since it was founded in the 1970s, the time for reminiscing was in the bar and the purpose of the symposium was to talk about the future, hear some new ideas, and discuss where we were going as an industry.

From IPC Standards to Practical DFM

10/21/2026 | Marcy LaRont, I-Connect007
DFM seems like common sense: If we know the rules a PCB must meet, why not check the design against them before it ever reaches the factory? In practice, of course, it’s not quite that simple. I caught up with Susan Kayesar, product manager at Siemens and longtime contributor to Global Electronics Association standards activities, to talk about an ongoing effort between Siemens and the Association to translate IPC requirements into practical, software-based DFM checks.

SEMICON West 2026: Another Sold Out Show

10/21/2026 | Marcy LaRont, I-Connect007
It was a beautiful Fall Day in the heart of downtown San Francisco, as I headed off to the first official day of SEMICON West 2026 on October 13th. Luckily, the beautiful, sunny and crisp Fall weather would endure throughout the week, just as the state was also seeing unprecedented storm activity, flooding and damaging wave activity on the Southern California coast, that juxtaposition in what had once been the only real tech-forward state in the U.S. not lost on me.
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