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Groundbreaking Ceremony Marks the Beginning of a New Era for Newccess Industrial; The Construction of the MINGXIN Building

04/12/2024 | Newccess Industrial
On a clear and sunny day in March, the groundbreaking ceremony for the MINGXIN Building took place in Shenzhen, China. This moment marked the official commencement of construction for a project that will reshape the semiconductor materials industry.

SEMI Issues Statement on Change to U.S. CHIPS Act Notice of Funding Opportunity

04/11/2024 | SEMI
SEMI, the industry association serving the global electronics design and manufacturing supply chain, issued the following statement from Ajit Manocha, SEMI President and CEO, after the United States Government announced it will no longer move forward with the Notice of Funding Opportunity for CHIPS funding for the construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States:

IFTEC’s Pierre-Jean Albrieux Inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2024

04/11/2024 | IPC
In recognition of his extraordinary contributions to IPC and the electronics manufacturing industry, Pierre-Jean Albrieux, president of IFTEC-France, was inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2024. IPC’s most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.

IPC APEX EXPO 2024 Day 2: A Focus on Workforce Development

04/11/2024 | I-Connect007 Editorial Team
Solving workforce development issues seemed to be a common theme among many conversations during the second day of IPC APEX EXPO 2024 in Anaheim, California. In his keynote address, “The Future of the Human Workforce: Maximizing Potential in an Automated World,” IPC President and CEO Dr. John W. Mitchell discussed the rapidly evolving workforce climate.

Plastronics and the New IPC Guidelines for In-mold Electronics (IME) 

04/11/2024 | Barry Matties, I-Connect007
In the ever-evolving world of electronics, the roads for the integration of electronics assemblies into 3D structures continue to grow into a set of technologies used to produce 3D plastronics parts and revolutionize mainly the automotive industry. IPC has been developing standards for this set of technologies, led by Francisco Fourcade, IPC electronics technology standards manager.
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