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Averatek Opens New Channels for Mina Surface Treatment
March 11, 2022 | AveratekEstimated reading time: 1 minute
Averatek is pleased to announce the addition of Jeff Berlin of TEC Associates to its marketing efforts. As a manufacturer's representative, Berlin will be responsible for business development with Mina, a surface treatment that enables soldering to aluminum. Replacing silver-based ACP (Anisotropic Conducting Paste) with solder, Mina offers more cost-effective and environmentally friendly manufacturing, with shorter processing times and reduced wet-chemistry steps.
“Mina™ lifts the constraints of traditional processes and opens a range of new applications – notably in the RFID, LED and automotive industries,” says Tara Dunn, Averatek Vice President of Marketing and Business Development “Helping business partners to realize the full benefits of this technology is a great fit for Jeff, with his years of industry experience.”
Soldering to aluminum traditionally requires an additional surface finish, such as Zincate and ENIG – or the use of conductive epoxy. These are cost-prohibitive and carry reliability challenges. Additionally, existing solders, fluxes and cleaners are formulated for copper-based PCBs and do not work well on aluminum.
“The culture of innovation at Averatek is energizing, and it is exciting to bring a breakthrough technology like Mina™ to the market,” says Jeff Berlin, TEC Associates Sales Representative. “Mina™ is a great addition to our line-up of quality products and a unique option for our customers.”
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Klaus Koziol - atgSuggested Items
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12/11/2025 | Indium CorporationIndium Corporation’s Senior R&D Manager of the Alloy Group, Hongwen Zhang, Ph.D., will present on the company’s award-winning Durafuse® Technology during the IEEE International Conference on Emerging Electronics (ICEE), December 13–16, in Bengaluru, India.
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12/09/2025 | Nolan Johnson, SMT007 MagazineAn ever-widening variety of components and denser board features are creating a gap for new equipment. Just as stencils are moving to multi-thickness panels for complex applications, soldering hardware is evolving to become more precise and integrated into the entire manufacturing line. Jeanine Norlin and Roberta Foster-Smith, representatives of Nordson Electronics Solutions, discuss the current state and implications of selective soldering, including a case study of a customer that made a change. How will selective soldering fit into your future?
Nolan’s Notes: A Tribute to Iola—and Automation
12/02/2025 | Nolan Johnson -- Column: Nolan's NotesIn the 1960s and ’70s, when the west side of the Portland, Oregon, metro area was dominated by Tektronix, my grandmother worked as one of the “assembly ladies.” Known as “Tek,” the company was an economic juggernaut, driving the economy of the cities of Beaverton, Tigard, and Hillsboro. The only employer larger than Tektronix was the state of Oregon itself; virtually every Portlander had some connection to Tek.
Indium Expert to Tackle Reliability Challenges in AI and High-Performance Computing at EPTC 2025
11/27/2025 | Indium CorporationIndium Corporation Research Metallurgist Huaguang Wang, Ph.D., will deliver a presentation at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025). The conference will be held December 2-5, 2025, in Singapore.
Altus Supports Concurrent Technologies’ Production Expansion with Advanced Inline Vapour Phase System
11/26/2025 | Altus GroupAltus Group, a leading distributor of capital equipment for the electronics industry, has successfully supplied Concurrent Technologies Plc (Concurrent), a designer and manufacturer of mission-critical embedded computing solutions, with their second ASSCON vapour phase soldering system, the innovative VP2100-100 inline unit.