-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Electronic System Design Industry Logs 14.4% YoY Revenue Growth in Q4 2021
April 4, 2022 | SEMIEstimated reading time: 1 minute
Electronic System Design (ESD) industry revenue increased 14.4% from $3,031.5 million in Q4 2020 to $3,468.2 million in Q4 2021, the ESD Alliance, a SEMI Technology Community, announced in its latest Electronic Design Market Data (EDMD) report. The four-quarter moving average, which compares the most recent four quarters to the prior four, rose 15.8%.
“The industry continued to report double-digit year-over-year revenue growth for Q4 2021 and ended 2021 with $13.2 billion total market revenue,” said Walden C. Rhines, Executive Sponsor of the SEMI Electronic Design Market Data report. “Product categories Computer-Aided Engineering, Printed Circuit Board and Multi-Chip Module, Semiconductor Intellectual Property, and Services recorded double-digit growth for the quarter. Geographically, the Americas; Europe, Middle East, and Africa (EMEA); and Asia Pacific (APAC) all reported revenue growth.”
The companies tracked in the EDMD report employed 51,236 people globally in Q4 2021, a 5.7% increase over the Q4 2020 headcount of 48,478 and up 0.1% compared to Q3 2021.
The quarterly EDMD report contains detailed revenue information with the following category and geographic breakdowns.
Revenue by Product and Application Category – Year-Over-Year Change
- Computer-Aided Engineering (CAE) revenue increased 11.2% to $1,064.6 million. The four-quarter CAE moving average increased 12.2%.
- IC Physical Design and Verification revenue decreased 2% to $624.5 million. The four-quarter moving average for the category rose 7%.
- Printed Circuit Board and Multi-Chip Module (PCB and MCM) revenue increased 13.9% to $333.7 million. The four-quarter moving average for PCB and MCM rose 15.1%.
- Semiconductor Intellectual Property (SIP) revenue jumped 24.8% to $1,314.3 million. The four-quarter SIP moving average grew 23.9%.
- Services revenue increased 43.1% to $131.1 million. The four-quarter Services moving average increased 19%.
Revenue by Region – Year-Over-Year Change
The Americas, the largest reporting region by revenue, procured $1,577.2 million of electronic system design products and services in Q4 2021, a 21% increase. The four-quarter moving average for the Americas rose 17.2%.
Europe, Middle East, and Africa (EMEA) procured $482.5 million of electronic system design products and services in Q4 2021, a 5.5% increase. The four-quarter moving average for EMEA grew 12.6%.
Japan’s procurement of electronic system design products and services decreased 2.4% to $222.8 million. The four-quarter moving average for Japan rose 1%.
Asia Pacific (APAC) procured $1,185.6 million of electronic system design products and services in Q4 2021, a 13.8% increase. The four-quarter moving average for APAC increased 18.9%.
Suggested Items
New Issue of Design007 Magazine: Are Your Data Packages Less Than Ideal?
05/09/2025 | I-Connect007 Editorial TeamWhy is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal data package for your design.
RF PCB Design Tips and Tricks
05/08/2025 | Cherie Litson, EPTAC MIT CID/CID+There are many great books, videos, and information online about designing PCBs for RF circuits. A few of my favorite RF sources are Hans Rosenberg, Stephen Chavez, and Rick Hartley, but there are many more. These PCB design engineers have a very good perspective on what it takes to take an RF design from schematic concept to PCB layout.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
The Right Blend: Mixed Wireless Technologies
05/08/2025 | Kirsten Zima, Siemens EDAA common trend recently is to employ as many radios as possible on a single PCB. With the increase of wireless standards and the downscaling of PCB size, it can be difficult to know what the most critical design parameters are to focus on. In this article, we’ll discuss the most important considerations to make when designing with mixed wireless technologies, such as Bluetooth, GPS, and Wi-Fi, on a single PCB. These considerations include antennas, frequencies, FCC compliance, shielding, and layout with and without transition vias.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.