-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAll About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Samtec’s Richard Mellitz Named Engineer of the Year at DesignCon 2022
April 7, 2022 | Business WireEstimated reading time: 3 minutes

Richard Mellitz, distinguished engineer at Samtec, was selected by peers as recipient of the 2022 Engineer of the Year Award. Amongst a field of brilliant and renowned engineers, Mellitz took home the well-earned title for his nearly 40 years as an engineer, producing work that has changed the course of interconnect signal integrity and industry standards. The award ceremony took place April 7 during DesignCon at the Santa Clara Convention Center.
"We could not be more excited to welcome Richard Mellitz into the Engineer of the Year hall of fame," remarked Suzanne Deffree, Group Event Director, DesignCon. "His work plays a significant role in changing the direction of the industry and shaping much-needed progress as emergent high-speed digital technologies and societal change continues to bring new challenges to the application of signal integrity. Congratulations on the well-deserved win, Richard."
Finalists for the Engineer of the year award were selected by the editors of Design News and DesignCon staff, and the DesignCon community voted the winner. DesignCon will present a $1,000 grant or scholarship to the educational institution of Mellitz’s choice in recognition of his achievements.
"It's an honor to be the recipient of this year's Engineer of the Year Award—a well-known and highly respected distinction in our industry," said Mellitz. "This year's applicant pool was outstanding, showcasing the breadth of talent and ingenuity foundational to industry advancement. Thank you to the DesignCon team for organizing such a successful event and for the award recognition; I'm truly appreciative."
Mellitz is presently a distinguished engineer at Samtec, supporting interconnect signal integrity and industry standards. Before this, he was a principal engineer in the Platform Engineering Group at Intel. Richard was a principal member of various Intel processor and I/O bus teams, including Itanium, Pentium, PCI Express, SAS, and Fabric (Ethernet, IB, and proprietary). Additionally, Mellitz has been a key contributor to the channel sections IEEE802.3 backplane and cabling standards and for the time domain ISI and return loss standards for IEEE802.3 Ethernet, known as COM (channel operating margin) and ERL (effective return loss), which are now an integral part of Ethernet standards due to his leadership.
Mellitz founded and chaired an IPC committee delivering IPC's first PCB loss test method. Prior to this, he led industry efforts at IPC to deliver the first TDR (time domain reflectometry) standard, which is presently used throughout the PCB industry. Richard holds many patents in interconnect, signal integrity, design, and test. He has delivered numerous signal integrity papers at electronic industry design conferences.
Finalists for the 2022 Award include:
- Scott McMorrow, CTO for Samtec's Signal Integrity Group. As a consultant for years too numerous to mention, Scott has helped many companies develop high-performance products while training signal integrity engineers.
- Steve Sandler, founder of Picotest.com, has been involved with power system engineering for more than 40 years. Steve is the founder of PICOTEST.com, a company specializing in power integrity solutions, including measurement products, services, and training. Steve is a long-time and very active member of the DesignCon Technical Program Committee.
- Lambert (Bert) Simonovich, founder of Lamsim Enterprises, has worked at Bell Northern Research/Nortel in Ottawa, Canada, where he helped pioneer several advanced technology solutions into products. In 2009, he founded Lamsim Enterprises Inc., where he continues to provide innovative signal integrity and backplane solutions as a consultant. He has authored several publications and is the holder of two US patents. In addition to being a senior member of IEEE, he currently serves as a member of DesignCon's Technical Program Committee, EDICon's Technical Advisory Committee and Signal Integrity Journal's Editorial Advisory Board.
RELATED VIDEO—Mellitz discussing his award:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Reflections and Priorities: An Update to I-Connect007 Readers
06/24/2025 | Marcy LaRont, I-Connect007The electronics and manufacturing industry is evolving rapidly—with new technologies, deeper global connections, and a growing drive toward sustainability. To reflect these changes and our place in this dynamic space, we’re refreshing our brand.
The Knowledge Base: Building the Workforce of Tomorrow With EMAC
06/24/2025 | Mike Konrad -- Column: The Knowledge BaseAs the electronics manufacturing industry races to meet rising global demand and technological complexity, the need for a highly skilled, future-ready workforce has never been greater. At the forefront of addressing this challenge is The Electronics Manufacturing & Assembly Collaborative (EMAC)—a national initiative dedicated to strengthening the talent pipeline through strategic collaboration with SMTA, education, and government stakeholders.
IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell
06/22/2025 | Marcy LaRont, I-Connect007Today, following a major announcement, IPC is embracing the rapid advancement of technology with a bold decision to change its name to the Global Electronics Association. This name more accurately reflects the full breadth of its work and the modern realities of electronics manufacturing. In this exclusive interview, Global Electronics Association President and CEO Dr. John W. Mitchell shares the story behind the rebrand: Why now, what it means for the industry, and how it aligns with the organization’s mission.
Global Electronics Association Debuts; New Name Elevates IPC’s 70-Year Legacy as Voice of $6 Trillion Electronics Industry
06/25/2025 | Global Electronics AssociationToday begins a new chapter for IPC as it officially becomes the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “Better electronics for a better world,” the Global Electronics Association (electronics.org) is dedicated to enhancing supply chain resilience and promoting accelerated growth through engagement with more than 3,000 member companies, thousands of partners, and dozens of governments across the globe.