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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
April 8, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
Spring has definitely sprung, and the trade show season continues to roll right along. Managing Editor Nolan Johnson just returned from DesignCon 2022, and as he says in his review, the attendance was up from last year’s event, which had been at the McEnery Convention Center in the waning days of the pandemic. I hope we’re getting back to normal, whatever that means.
This week, we have a few articles about Industry 4.0, as well as a column on setting your priorities. We have a cool article about methods for measuring the breakdown of resins during multiple thermal laminations, and a conversation with an EMS company president who realized that he was actually running a data collection firm that happened to make circuit boards. Can you say the same about your own company?
DesignCon 2022: Back to Business as Usual
Published April 7
This week, DesignCon returned to its old stomping grounds, the Santa Clara Convention Center in Silicon Valley. It’s been over two years since the annual design engineering event was last held here, and attendees and exhibitors were glad to be back to normal, more or less. Let’s congratulate Richard Mellitz of Samtec for taking home the “Engineer of the Year” award, along with finalists Scott McMorrow, Steven Sandler, and Design007 contributor Bert Simonovich. Nolan Johnson brings us this DesignCon wrap-up.
The Future is Driven by Data
Published April 7
History is full of “A-ha” moments, when inventors and leaders had that proverbial lightbulb turn on in their brain. In this interview with Rocket EMS President Michael Kottke, he discusses his DIY implementation of Industry 4.0 systems, and how everything changed with the realization that he is now running a data collection business that just happens to build printed circuit boards. Check it out.
Smart Factory Insights: Has the Industry 4.0 Gold Rush Ended?
Published April 6
Speaking of Industry 4.0, it’s hard to believe that this concept is now five years old, well past the toddler stage in life. But as columnist Michael Ford points out, the Gold Rush surrounding Industry 4.0 may have run its course. In this column, Michael discusses the various winners and losers who have risked it all for the chance of striking gold in this new territory.
The Right Approach: The Law of Priorities
Published April 7
With so many of us wearing multiple hats each day, setting priorities becomes a task in itself. Steve Williams has a column that a lot of us will identify with as he continues counting down the 21 Irrefutable Laws of Leadership. As Steve says, balancing your priorities will enable you to more thoroughly enjoy your career as well as your recreational time.
Measuring Multiple Lamination Reliability for Low-loss Materials
Published April 4
John Strubbe of TUC has a great article about the effects of multiple thermal lamination cycles on resin’s physical properties. He takes dynamic mechanical analysis, stress-strain curves, Young’s modulus, yield strength, and ultimate tensile strength, and boils it all down so that the rest of us can understand it. This is good stuff.
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Mycronic Secures Turnkey Solution Order from a Nordic Defense Actor
11/05/2025 | MycronicMycronic has received a full-line, ready-to-use solution order from a major defense industry supplier based in the Nordic region. The order encompasses a complete solution for advanced circuit board manufacturing, including high-tech production equipment and integrated software systems.
SEMI Foundation Honors Applied Materials at SEMICON West with 2025 Excellence in Achievement Award for Talent Development
11/04/2025 | SEMIThe SEMI Foundation announced it recognized Applied Materials, Inc. with the Excellence in Achievement Award at SEMICON West 2025 in Phoenix, Arizona, honoring the company’s outstanding leadership and collaboration in building the next generation of semiconductor talent.
Update: Technica USA Begins Exclusive U.S. Distributor for DCT Cleaning Products
11/03/2025 | Technica USATechnica USA is pleased to announce they have begun shipping product for DCT USA, LLC today. Technica recently announced a strategic partnership as the exclusive master distributor of DCT cleaning products in the United States, which became effective November 1, 2025.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.