Target Condition: Distribution of Power—Denounce the Ounce
Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing
Designers Notebook: Power and Ground Distribution Basics
A Definitive Review of New Expert Guide to High-Performance Materials
April 13, 2022 | Happy Holden, I-Connect007Estimated reading time: 2 minutes
I am always surprised when a colleague produces a statement about PCB laminates that seems incorrect or out of date. This need not happen today as the specialists at Isola have written an excellent book about high performance materials, now available for download from I-Connect007.
Author Michael Gay, a 25-year veteran of laminate manufacturing, meticulously guides readers through the most pertinent questions regarding rigid laminates. This is essential information for everyone, including the experts, because the materials and applications for laminates in printed circuits are constantly changing. Fortunately, Michael focuses on the basics of high-performance materials being used in today’s printed circuit boards.
And Isola should know. The company has been making high-performance and advanced materials for the electronics industry since 1956, remaining among only a handful of companies producing these materials. As the basis for all printed circuit boards, laminate is the major cost driver for PCBs and determines much of its electrical performance. To understand and design printed circuits, you first must understand the PCB materials.
In The Printed Circuit Designer’s Guide to… High Performance Materials, Michael first provides a brief history of laminates in this industry. He then proceeds to deliver a thorough education of laminates. But what does that look like?
It starts with resin systems (there are many), while including the role of fillers (again, many) and flame retardants. Next are the reinforcements, especially glass fabrics which must include the types of glass—glass styles, glass weaves, and glass constructions (i.e., spread glass). This is followed by how you use the prepregs (glass fabrics impregnated with resin and partially cured) and multilayer material constructions. Topics like “range of fill capabilities,” “dielectric properties,” and “stackup advice”—including calculating impedances—come into the picture.
Add copper foil, the final element to prepreg, and you have a rigid laminate. But all copper foils are not created equal, so the author covers surface treatments and roughness, especially for high-frequency skin effect.
This book concludes with more information about electrical performance and, particularly, the growing automotive use of laminates when voltages and currents are particularly high but subjected to the environmental extremes that automobiles will see.
This is where you must start, but not where you will end. Visit the I-007 eBook library to find other titles in The Printed Circuit Designer’s Guide to… series covering PCB materials for flex, rigid-flex, and more on electrical performance.
Happy Holden has worked in printed circuit technology since 1970 with Hewlett-Packard,?NanYa?Westwood, Merix, Foxconn, and Gentex. He is currently a contributing technical editor with I-Connect007, and the author?of?Automation and Advanced Procedures in PCB Fabrication, and?24 Essential Skills for Engineers.?To read past columns or contact Holden, click here.?
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Trouble in Your Tank: Understanding Interconnect Defects, Part 1
11/04/2025 | Michael Carano -- Column: Trouble in Your TankThis month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.