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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
April 22, 2022 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication, and assembly communities. The roller coaster ride continues, with whiplash-inducing news from IPC about March North American shipment—they’re up from February but down from the same period a year ago.
We also have articles that cover everything from upskilling your labor force to using big data to help bring manufacturing back to North America. We have a review of one of our latest books, Printed Circuit Designer’s Guide to… Stackups: The Design within the Design, and a great column by Anaya Vardya about the need for American manufacturers to stop viewing one another as adversaries and start working together. We’re down to 200 domestic fabricators; cooperation may be the only answer.
As Ben Franklin said, “We must, indeed, all hang together or, most assuredly, we shall all hang separately.”
IPC Releases PCB Industry Results for March 2022
Published April 22
Good news, bad news: According to IPC, March North American PCB shipments rose 5.6% over the previous month but fell 11.7% YOY. As Shawn DuBravac says, supply chain issues are improving just as orders are dropping in various markets. Never a dull moment in this industry.
Training the Future Manufacturing Labor Force
Published April 19
There’s been a lot of talk about the need to “upskill” the PCB manufacturing labor force, but what does that entail, exactly? In this interview, Michael Connella, Matt Stevenson, and Debra Coburn discuss Sunstone Circuits’ plans to keep their staff trained on the latest in fabrication technology and processes.
Big Data Can Bring Your Business Back
Published April 20
It’s all about data. In this industry, you either manage your data or you get left behind. But big data may provide the advantage that North America needs to regain some of the work lost to overseas companies. In this article, Siemens’ Zac Elliott explains how big data just might be the differentiator that American companies have been waiting for.
The Printed Circuit Designer’s Guide to… Stackups: The Design within the Design
Published April 18
The I-Connect007 book Printed Circuit Designer’s Guide to… Stackups: The Design within the Design has been flying off our virtual newsstand. No wonder: The stackup may be the most important part of your PCB design. One of our readers, signal integrity engineer Skyler Sopp, has written a review of this timely tome. Check it out.
Standard of Excellence: From Adversaries to Collaborators—Let’s Do This Together
Published April 20
Columnist Anaya Vardya makes a great point here: “Our domestic PCB industry could have stood stronger and been much more vibrant today if we had stood together, shoulder to shoulder as one united industry. But alas, we did not, and today this what we have: fewer than 200 companies striving to stay alive with our wagons still moving in a straight and vulnerable line instead of coming together in a circle of strength.” Don’t miss this column.
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Brent Fischthal - Koh YoungSuggested Items
Simplifying Software Integration for Every Factory
10/22/2025 | Nolan Johnson, SMT007 MagazineAs a leading provider of factory digitalization solutions for electronics manufacturers, Cogiscan is at the heart of the software integration process. Davina McDonnell, director of marketing and product management, discusses how Cogiscan ensures that customers are ready to integrate and what it looks for to ensure a quick and appropriate installation.
MES Software Tools Need Thoughtful Integration
10/21/2025 | Nolan Johnson, SMT007 MagazineThe Global Electronics Association recently published a survey report on the state of EMS production software. This project, led by Thiago Guimaraes, director of industry intelligence, connects the dots across the global electronics value chain to uncover practical insights that individual companies might not have seen on their own. In this interview, Thiago discusses the whys and hows of this report.
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Technica USA Named Exclusive U.S. Distributor for DCT Cleaning Products
10/14/2025 | Technica USATechnica USA is pleased to announce a strategic partnership with DCT USA, LLC, becoming the exclusive master distributor of DCT cleaning products in the United States, effective November 1, 2025.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.