-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
FLEX Conference 2022 to Highlight Latest Flexible Hybrid Electronics Innovations
April 26, 2022 | SEMIEstimated reading time: 1 minute
FLEX Conference will gather industry experts July 11-14, 2022, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions and product-based demonstrations highlighting the latest innovations in flexible and printed electronics. The event will co-locate with SEMICON West Hybrid, North America’s premier microelectronics exhibition and conference that unites players across the entire electronics manufacturing and design supply chain. Registration for both events is open.
Themed Electronics in Motion, FLEX Conference 2022 will focus on equipment, processes, materials and applications driving the latest flexible hybrid electronics (FHE) technology breakthroughs. The event will also showcase innovations emerging from public-private partnerships formed by SEMI Technology Communities SEMI-FlexTech, SEMI-NBMC (Nano-Bio Materials Consortium) and SEMI-NextFlex.
“FLEX Conference has consistently helped turn great ideas into game-changing applications for smart transportation, buildings and infrastructure; equipment sensorization; wearable and conformable medical devices; and more,” said Dr. Melissa Grupen-Shemansky, SEMI CTO and vice president of SEMI Technology Communities. “We are excited to co-locate FLEX with SEMICON West Hybrid to advance the integration of traditional rigid electronics with flexible electronics to improve the way the world works and lives.”
Advances in sustainability across both industries will come into focus at the Global Sustainability Summit at SEMICON West Hybrid and FLEX as flexible electronics combine new levels of processing and sensing capability with improved power usage to make the devices more eco-friendly.
FLEX Conference 2022 Breakout Sessions
- FHE Applications
- Flexible MedTech and Wearables
- Printing and Processing
- Reliability and Inspection
- Strategies and Sustainability
- Flexible Conductive Materials and Inks
- Flexible Power
- FHE Processing and Integration
The Design Automation Conference (DAC), the largest meeting in the electronic design automation (EDA) industry, will also co-locate with SEMICON West Hybrid 2022.
Suggested Items
Creative Electron Strengthens Leadership Team with Strategic Appointments in Marketing and SMT Business Unit
05/08/2025 | Creative ElectronCreative Electron, the largest U.S. manufacturer of X-ray inspection systems for the electronics industry, is proud to announce the addition of two seasoned leaders to its executive team: Wagner Lima as Marketing Director and Giancarlo De La Garza as SMT Business Unit Director.
LG Electronics India Limited Begins Construction of Its Third Manufacturing Plant in India
05/08/2025 | BUSINESS WIRELG Electronics India Ltd. (LGEIL) announced the commencement of construction of its new manufacturing facility in Sri City, Andhra Pradesh today at a ceremony graced by the presence of Shri Nara Lokesh, Hon'ble Minister for Information Technology, Electronics and Communications.
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
IPC Strengthens Global Focus with Promotion of Sanjay Huprikar to Chief Global Officer
05/08/2025 | IPCIPC, the global electronics association, announces the promotion of Sanjay Huprikar to chief global officer. This newly created position reflects the association’s forward-looking strategy and industry needs to strengthen the electronics supply chain.
IPC White Paper Maps the Regulatory Terrain for Electronics Suppliers in E-Mobility Sector
05/07/2025 | IPCElectronics suppliers supporting the rapidly growing e-mobility sector are facing a dramatic escalation in environmental and social governance (ESG) compliance expectations. A new white paper from IPC’s e-Mobility Quality and Reliability Advisory Group provides a comprehensive overview of the evolving regulatory landscape and outlines the data infrastructure needed to stay ahead.