Global PCB Connections: Let the Spec Fit the Board, Not Just the Brand
Beyond Design: Refining Design Constraints
The Pulse: Design Constraints for the Next Generation
Designing Additive and Semi-Additive PCBs
April 26, 2022 | Cherie Litson, CID+, Litson1 ConsultingEstimated reading time: 1 minute
With components getting smaller and electronic devices becoming more compact, we are reaching the physical limits of the typical etched fabrication processes. To address these limits, new additive and semi-additive processes are being developed to fit into the current fabricators’ production lines without too much disruption or extra cost.
That leaves the design engineer with a few questions: Will additive and semi-additive processes really reduce layer count and sizes? Are there signal integrity and impedance advantages and disadvantages? When does it makes sense to switch to additive or semi-additive? Are my DFMs going to be any different?
Answers to these questions and many more are still being developed. However, I’ve found a few answers that I’m happy to share with you.
First, let’s look at liquid metal ink. LMI is ultra-thin and ultra-dense, conforms to any 3D surface, works with different pure metals and their alloys (copper, gold, silver, palladium, platinum, etc.), and is non-aqueous, which enables low-cost manufacturing.
Here are some fundamentals for these very small features. Figure 1 depicts some examples of the additive processes used to create fine copper traces on a printed circuit board. One of the first things you’ll notice are the shapes of the traces: They are not trapezoidal.
To read this entire article, which appeared in the April 2022 issue of Design007 Magazine, click here.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/18/2025 | Nolan Johnson, I-Connect007It may be the middle of the summer, but the news doesn’t quit, and there’s plenty to talk about this week, whether you’re talking technical or on a global scale. When I have to choose six items instead of my regular five, you know it’s good. I start by highlighting my interview with Martyn Gaudion on his latest book, share some concerning tariff news, follow that up with some promising (and not-so-promising) investments, and feature a paper from last January’s inaugural Pan-European Design Conference.
Elephantech Launches World’s Smallest-Class Copper Nanofiller
07/17/2025 | ElephantechJapanese deep-tech startup Elephantech has launched its cutting-edge 15 nm class copper nanofiller – the smallest class available globally. This breakthrough makes Elephantech one of the first companies in the world to provide such advanced material for commercial use.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
07/11/2025 | Andy Shaughnessy, Design007 MagazineThis week, we have quite a variety of news items and articles for you. News continues to stream out of Washington, D.C., with tariffs rearing their controversial head again. Because these tariffs are targeted at overseas copper manufacturers, this news has a direct effect on our industry.I-Connect007 Editor’s Choice: Five Must-Reads for the Week
Digital Twin Concept in Copper Electroplating Process Performance
07/11/2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.