Global Citizenship: Cultivating Cross-border Partnerships With Integrity
Nolan’s Notes: Moving Forward With Confidence
The Knowledge Base: Beyond the Badge—Why Membership Matters More Than Ever
AIM Announces New AIM LUX Product Line
May 25, 2022 | AIMEstimated reading time: 1 minute
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce the release of its new AIM LUXTM Product Line.
As a leading supplier to the miniLED industry, AIM designed its LUX solder materials to provide tier one manufacturers of LED, miniLED and hi-power LED assemblies with solder pastes and alloys to solve production challenges associated with these applications.
The LUX product line pairs ultra-fine SAC-based and silver-free Type 6, 7 and 8 alloy powders along with innovative flux chemistries. AIM’s NC259 series is proven to provide excellent soldering performance and high production yields. When combined with the SN100C® alloy, NC259 solder pastes eliminate silver migration concerns. AIM REL61TM is a low-silver alloy option that can lower peak reflow temperature requirements and improve mechanical strength over other low/no-silver alloys. For high-power LEDs, AIM's REL22TM doubles the service life under extreme thermal cycling conditions. AIM's Tacky Flux offers high tack forces, long open time, and improved wetting for all mass transfer and high-speed dipping applications.
“The Mini/MicroLED market is poised to experience exponential growth over the next 2-3 years,” said Timothy O’Neill, AIM’s Director of Product Management. “AIM LUX product line has been developed specifically to meet the needs of current and emerging technologies.”
Share on:
Suggested Items
Preventing Surface Prep Defects and Ensuring Reliability
06/10/2025 | Marcy LaRont, PCB007 MagazineIn printed circuit board (PCB) fabrication, surface preparation is a critical process that ensures strong adhesion, reliable plating, and long-term product performance. Without proper surface treatment, manufacturers may encounter defects such as delamination, poor solder mask adhesion, and plating failures. This article examines key surface preparation techniques, common defects resulting from improper processes, and real-world case studies that illustrate best practices.
Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line
06/09/2025 | Dr. Eyal Weiss, CybordAs the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.