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Boyd Acquires Sensata’s Thermal Test and Controls Business
July 5, 2022 | Boyd CorporationEstimated reading time: 1 minute
Boyd, a world-leading innovator of technologies in engineered materials and thermal management, announced it acquired Sensata’s Thermal Test and Controls Business.
This business specializes in the design and manufacturing of advanced thermal control systems, adapters, and sockets critical to the thermal test process for high-end logic and memory semiconductors. With a long history of serving leading global semiconductor companies, the addition complements Boyd’s existing thermal business, which includes air and liquid cooled thermal management technologies.
Boyd designs and manufactures complex thermal solutions for high-performance semiconductors used in applications such as 5G, hyperscale data center, eMobility, and artificial intelligence. With this acquisition, Boyd expands its offering to current semiconductor customers by adding advanced controls and thermal test systems essential to the production of high-end memory and logic devices.
“This acquisition is a natural fit for Boyd and adds to our portfolio of thermal solutions for leading semiconductor companies,” said Boyd CEO Doug Britt. “The advanced technologists, material scientists, and solutions from Sensata’s Thermal Test and Controls Business broaden Boyd’s presence in the rapidly growing semiconductor industry.”
The acquired business will operate under the Boyd brand – which has delivered Trusted Innovation for nearly 100 years. We have closed our acquisition of the business, except for in Korea, which is pending customary regulatory approval.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/16/2024 | Nolan Johnson, I-Connect007People are on the move, new books are being released, and a new PCB manufacturer is making waves. This week, I'm highlighting the latest ASC/Sunstone book on DFM essentials, our 40th book in the I-Connect007 library and a must-read whether you're a new or seasoned member of industry. I'm also including leadership news from NextFlex, a discussion on integrated passives from Joe Fjelstad, and a new processor chip from Intel meant specifically for automotive applications.