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Boyd Acquires Sensata’s Thermal Test and Controls Business
July 5, 2022 | Boyd CorporationEstimated reading time: 1 minute
Boyd, a world-leading innovator of technologies in engineered materials and thermal management, announced it acquired Sensata’s Thermal Test and Controls Business.
This business specializes in the design and manufacturing of advanced thermal control systems, adapters, and sockets critical to the thermal test process for high-end logic and memory semiconductors. With a long history of serving leading global semiconductor companies, the addition complements Boyd’s existing thermal business, which includes air and liquid cooled thermal management technologies.
Boyd designs and manufactures complex thermal solutions for high-performance semiconductors used in applications such as 5G, hyperscale data center, eMobility, and artificial intelligence. With this acquisition, Boyd expands its offering to current semiconductor customers by adding advanced controls and thermal test systems essential to the production of high-end memory and logic devices.
“This acquisition is a natural fit for Boyd and adds to our portfolio of thermal solutions for leading semiconductor companies,” said Boyd CEO Doug Britt. “The advanced technologists, material scientists, and solutions from Sensata’s Thermal Test and Controls Business broaden Boyd’s presence in the rapidly growing semiconductor industry.”
The acquired business will operate under the Boyd brand – which has delivered Trusted Innovation for nearly 100 years. We have closed our acquisition of the business, except for in Korea, which is pending customary regulatory approval.
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The Global Electronics Association Releases IPC-8911: First-Ever Conductive Yarn Standard for E-Textile Application
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Magnalytix and Foresite to Host Technical Webinar on SIR Testing and Functional Reliability
06/26/2025 | MAGNALYTIXMagnalytix, in collaboration with Foresite Inc., is pleased to announce an upcoming one-hour Webinar Workshop titled “Comparing SIR IPC B-52 to Umpire 41 Functional & SIR Test Method.” This session will be held on July 24, 2025, and is open to professionals in electronics manufacturing, reliability engineering, and process development seeking insights into new testing standards for climatic reliability.
Defense Speak Interpreted: Is DARPA Still Around After CHIPS?
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/13/2025 | Marcy LaRont, I-Connect007Today is Friday the 13th, and in much of Western folklore, this is a day when bad luck is lurking. But while Friday the 13th may top Western superstition charts, the global calendar is sprinkled with its own unlucky legends. In Spain and Greece, the bad juju lands on Tuesday the 13th—a day linked to Mars, the god of war, and naturally, chaos. In Italy, it’s Friday the 17th that is feared, thanks to the Roman numeral XVII, which can be rearranged to spell VIXI—Latin for “I have lived” (a poetic way of saying you’re dead).