-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSolder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
A Culture of Thriving
One cannot simply command thriving; it must be nurtured, developed, and encouraged. In this issue, we explore strategies to improve your working relationship model—both internally and externally. In this culture of thriving, your business will grow in the process.
Certifications
Certifications have historically been seen as a cost of doing business, but how do we turn them into a positive ROI and a value to both customer and vendor?
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SMTA International Technical Conference: Trending on Topic
October 19, 2022 | SMTAEstimated reading time: 1 minute
![](https://iconnect007.com/application/files/6716/9087/0140/Julie_Silk.jpg)
One of the highlights of SMTA International is the Technical Conference, where more than 100 papers will be presented across at least 30 sessions.
“Work that was delayed due to the effects of COVID has been completed and the amount of material coming from the industry is impressive,” says Julie Silk, VP of technical programs. “We have a packed conference this year in Minneapolis.”
The Technical Conference is part of SMTA International, scheduled for Oct. 31 to Nov. 3, at the Minneapolis Convention Center in Minneapolis, Minnesota. To attend the conference sessions, registration is required.
The Technical Conference is organized and managed by Silk, who works for Keysight Technologies, and Raiyo Aspandiar of Intel Corporation and SMTAI conference chair.
They are assisted by the SMTA International Technical Advisory Committee (TAC), which is comprised of distinguished electronics manufacturing and packaging industry experts. They designed the conference to ensure that the latest trends and developments are fully addressed.
The Technical Conference has nine technical tracks:
- Advanced Packaging (APT)
- High Performance and Reliability (HPR)
- Interconnect Research and Reliability (IRR)
- Low Temperature Solder (LTS)
- Manufacturing Excellence (MFX)
- Materials for Electronics (MAT)
- Medical & Defense Symposium (MD)
- Technical Innovations (TI)
- Test and Inspection (INS)
Silk says some of the tracks have been renamed from previous years to better describe the content for these sessions. For example, High Performance and Reliability (HPR) “covers the unique requirements in industries such as automotive and space,” she says. “M&D covers papers on substrates, PCB fabrication chemistries, adhesives, solders, and more.”
The Interconnect Reliability and Research (IRR) Symposium has outstanding content that will help attendees understand the mechanisms that drive failure.
The following track names have remained the same:
- Advanced Packaging Technology: Includes new research completed since the very popular Wafer Level Packaging Symposium in the spring
- Inspection and Test (INS): Highlights useful testing
- Technical Innovations: Covers machine learning, digital factory, and unique processes
There were so many papers in the Manufacturing Excellence (MFX) and Low Temperature Solder (LTS) tracks that there are several sessions for each.
Originally published in the October 2022 issue of SMT007 Magazine, click to continue reading this article.
Suggested Items
Eutect Overcomes Panel Soldering Challenges with New Gripper
09/06/2024 | Eutect GmbHThe selective soldering of assemblies in panels is not a real challenge. However, if you need to solder relatively large panels with towering components, specialists like those at Eutect GmbH have to step up to the plate.
AIM Solder Appoints Kevin Kwan as Business Development Manager in Asia
09/06/2024 | AIM SolderAIM Solder, a global leader in solder assembly materials for the electronics industry, is thrilled to announce the appointment of Kevin Kwan as Business Development Manager for the Asian market.
Solder Printing: A 1:1 Ratio of Technical and Creative
09/03/2024 | Nolan Johnson -- Column: Nolan's NotesWhen things get technical, I’m in my happy place. It’s why I work in technology in the first place. I also happen to enjoy creative pursuits, and my real happy place is when both happen at the same time. Over the years, it seems that most of us engaged in printed circuit design and manufacturing are similarly wired. I don’t think I’m alone in stating that finding a creative solution to a technical problem is one of the highlights of our workday. We get bonus points if the solution is particularly simple or uncomplicated.
AIM to Present on Ultra-Miniature Assembly for Mini/MicroLEDs at MicroLED Connect
09/03/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming MicroLED Connect Conference and Exhibition taking place September 25-26 in the Conference Center at High Tech Campus Eindhoven in The Netherlands.
STARTEAM GLOBAL Announces Strategic Partnerships with Notion Systems and Peters Group
09/03/2024 | STARTEAM GLOBALSTARTEAM GLOBAL, an established printed circuit board (PCB) manufacturer with over 35 years of expertise, is pleased to announce new strategic partnerships with two German corporations: Notion Systems GmbH, a manufacturer of inkjet printing systems for functional materials, and Lackwerke Peters GmbH & Co. KG, also known as Peters Group, a full-range supplier of coating materials for electronics and PCBs worldwide.