Elementary, Mr. Watson: The Gooey Centers of Hybrid PCB Designs
Designer's Notebook: Heterogeneous Integration and High-density SiP TechnologiesSunstone and I-007eBooks Launch Book on Designing for Reality
October 27, 2022 | I-Connect007Estimated reading time: 1 minute
I-007eBooks is excited to announce the release of the latest title in its series for designers, The Printed Circuit Designer’s Guide to… Designing for Reality.
This book covers both written and unwritten rules for how to create a realistic, manufacturable design.
Written by topic expert Matt Stevenson of Sunstone Circuits, this book covers the complete circuit board manufacturing process, taking readers on a virtual tour of the printed circuit manufacturing process, from choosing the right CAD tool, to additive/subtractive processes, and even touching on the art of PCB design.
Peer reviewer Duane Benson of Screaming Circuits, says, “I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening the hood and giving the reader that knowledge of the PC board fab process.”
Download your free copy today at I-007eBooks.com/dfr. You can also view our full library at I-007eBooks.com.
Dedicated to educating PCB designers, The Printed Circuit Designer’s Guide to… series of books is a valuable resource for people seeking the most relevant information available.
Look for other exciting titles, like:
- The Evolving PCB NPI Process
- Thermal Management with Insulated Substrates
- Stackups: The Design within the Design
- High Performance Materials
- System Analysis: Electromagnetic Interference and Thermal Analysis of Electronic Systems
- …and more coming this fall
We hope you enjoy The Printed Circuit Designer’s Guide to… Designing for Reality.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727
Share on:
Suggested Items
SMT Perspectives and Prospects: The AI Era, Part 3: LLMs, SLMs, and Foundation Models
10/09/2024 | Dr. Jennie Hwang -- Column: SMT Perspectives and ProspectsSince the introduction of ChatGPT on Nov. 30, 2022, and ChatGPT4 on March 14, 2023, large language models (LLMs) have been in everyday news and conversations. LLMs represent a significant advancement in AI, which has the potential to revolutionize multiple fields. This column offers a snapshot of LLMs from the user’s perspective.
NEOTech Announces Implementation of Enhanced Wire Bonding Process to Boost Microelectronics Manufacturing Efficiency
10/08/2024 | NEOTechNEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is excited to announce the recent implementation of an enhanced wire bonding manufacturing process for microelectronics circuit assemblies.
MVTec at the SEMICON Europa Trade Fair: Machine Vision as a Key Technology for Semiconductor Manufacturing
10/07/2024 | MVTec Software GmbHMVTec Software GmbH, a leading global provider of machine vision software, will be exhibiting again this year at SEMICON Europa in Munich, taking place from November 12 to 15, 2024.
HCLTech Announces AI-based Solutions Powered by Intel Core Ultra Processors
10/04/2024 | HCLTechHCLTech, a leading global technology company, will provide advanced AI-driven digital workplace solutions utilizing Intel Core Ultra processors.
KYZEN to Feature Full Line of Metal Cleaning Chemistries at FABTECH
10/01/2024 | KyzenKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at FABTECH 2024, scheduled to take place October 15-17, 2024 at the Orange County Convention Center in Orlando, FL.