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The Five Most-read Design007 Articles of 2022
December 27, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

Each December, we like to look back at the most popular articles of the past 12 months. You never know which article is going to blow up like a Blake Shelton album.
So, put on your ugliest holiday sweater and prop up that iPad. For your holiday enjoyment, here’s a blast from the past: the top five most-read Design007 articles of 2022.
Ventec’s Book on Thermal Management: The Summer Sequel You’ve Been Waiting For
The I-Connect007 eBooks have been moving like hotcakes, and Ventec’s 2022 offering got a lot of eyeballs on the page. Co-written by Ventec’s Didier Mauve and Robert Art, The Printed Circuit Designer’s Guide to… Thermal Management with Insulated Metal Substrate, Volume 2 was the second in the series, and PCB designers snapped it up. This article about the book launch was the most-read Design007 article of the year.
High-Voltage Circuit Design Guidelines and Materials
More of our readers seem to be entering the high-voltage arena lately, and this article by Celso Faia and Davi Correia of Cadence Design Systems rode a voltage spike into our top five. As they point out, a lot of high-voltage issues can be precluded early in the design cycle—if you know what you’re doing. Check it out.
Flexible Hybrid Electronics Design: Reducing Time to Market
Flex and rigid-flex design has been a hot topic for a few years, and Sean Nachnani’s article on flexible hybrid design flexed its biceps all the way into our five most-read items. NextFlex is leading much of the research in this space, and they’ve published a variety of articles this year. As we’ve seen, many of our readers are being forced into flex for one reason or another, and flex hybrids are making inroads into this segment now.
Kris Moyer Discusses New IPC Role
There’s an old saying in business-to-business publishing: People like reading about other people, and it shows. Our interview with IPC design instructor Kris Moyer was the most popular PCB design interview of 2022. More young people are entering this segment, and designers and design engineers are yearning for cutting-edge design education.
Altium Focusing on Educating Designers of Today and Tomorrow
Altium has been working with the educational community for years, providing EDA software to universities and holding educational events such as AltiumLive and Altium Education. This interview with Altium VP of Education Rea Callender and consultant Zach Peterson shot up into our most-read earlier this year. Education may be the hottest of the hot topics in PCB design now.
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Julia McCaffrey - NCAB GroupSuggested Items
Accelerating Embedded Innovation: Orthogone Becomes Texas Instruments Design Partner
09/17/2025 | PRNewswireOrthogone Technologies Inc., a leader in advanced embedded systems and FPGA development, is proud to announce its official designation as a Texas Instruments (TI) Design Services Partner.
BLT Joins Microchip Partner Program as Design Partner
09/17/2025 | BUSINESS WIREBLT, a U.S.-owned and operated engineering design services firm announced it has joined the Microchip Design Partner Program.
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
American Standard Circuits to Exhibit and Host Lunch & Learn at PCB West 2025
09/17/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Circuits/ASC Sunstone Circuits has announced that his company will once again be exhibiting at PCB West 2025 to be held at the Santa Clara Convention Center on Wednesday, October 1, 2025.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.