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The Five Most-read Design007 News of 2022
December 28, 2022 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes
![](https://iconnect007.com/application/files/5916/9087/0703/Design_2022news_review_headlinemedia.jpg)
Each December, we like to look back at the most popular news of the past 12 months. You never know which news item is going to blow up like a Harry Styles album.
So, grab some leftover ham and hang out with us for a while. For your holiday enjoyment, here’s a blast from the past: the top five most-read Design007 news of 2022.
IPC Training Course on PCB Design for Printed and Wearable Devices
It’s not surprising that the No. 1 design news item of 2022 is related to IPC’s design curriculum. Now is the time to be a PCB design instructor, because designers are constantly retiring or slipping that mortal coil, and we’re losing subject matter experts all the time. Chances are that if you are a design instructor, you’re around retirement age, but we’re going to need you to keep on teaching. As the manager said in “Office Space,” “Yeahhh, that would be great.”
Insulectro Hires PWB Commodity Specialist Laura Martin as Director of Technology
We don’t usually see news about new hires in the Top Five for any given year, but a couple of thousand people read about Laura Martin’s new gig at Insulectro. She’s a fabrication guru, but we’re including this news piece because Laura teaches classes for PCB designers who have never darkened the door of their neighborhood board shop. Does that sound like any designers you know?
Altium, MacroFab Launch Industry-First Integrated PCB 'Design With Manufacturing' Application
There’s been a lot of talk about various ways to help PCB designers communicate with manufacturers, and Altium shot up into the No. 3 spot for 2022 with this news item about their partnership with MacroFab. Slowly but surely, more and more designers are beginning to communicate with their fabrication and assembly providers.
Samtec’s Richard Mellitz Named Engineer of the Year at DesignCon 2022
Richard Mellitz has been in the design world for decades, and we were glad to see him take home “Engineer of the Year” at DesignCon this year. Among other things, Richard helped create the first TDR (time domain reflectometry) standard for IPC. It’s nice to see him get recognized.
IPC Training Course on PCB Design for Embedded Components
Embedded components have been taking off over the past few years, and IPC’s embedded component design curriculum seems to have taken off as well. You can expect to see a lot more news about embedded components and advanced packaging in 2023. It’s only getting more complex!
Suggested Items
Intervala Hosts Employee Car and Motorcycle Show, Benefit Nonprofits
08/27/2024 | IntervalaIntervala hosted an employee car and motorcycle show, aptly named the Vala-Cruise and it was a roaring success! Employees had the chance to show off their prized wheels, and it was incredible to see the variety and passion on display.
KIC Honored with IPC Recognition for 25 Years of Membership and Contributions to Electronics Manufacturing Industry
06/24/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, is proud to announce that it has been recognized by IPC for 25 years of membership and significant contributions to electronics manufacturing.
Boeing Starliner Spacecraft Completes Successful Crewed Docking with International Space Station
06/07/2024 | BoeingNASA astronauts Barry "Butch" Wilmore and Sunita "Suni" Williams successfully docked Boeing's Starliner spacecraft to the International Space Station (ISS), about 26 hours after launching from Cape Canaveral Space Force Station.
KIC’s Miles Moreau to Present Profiling Basics and Best Practices at SMTA Wisconsin Chapter PCBA Profile Workshop
01/25/2024 | KICKIC, a renowned pioneer in thermal process and temperature measurement solutions for electronics manufacturing, announces that Miles Moreau, General Manager, will be a featured speaker at the SMTA Wisconsin Chapter In-Person PCBA Profile Workshop.
The Drive Toward UHDI and Substrates
09/20/2023 | I-Connect007 Editorial TeamPanasonic’s Darren Hitchcock spoke with the I-Connect007 Editorial Team on the complexities of moving toward ultra HDI manufacturing. As we learn in this conversation, the number of shifting constraints relative to traditional PCB fabrication is quite large and can sometimes conflict with each other.