The Shaughnessy Report: Watt About Power Integrity?
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
January 2023 Issue of Design007 Magazine Available Now
January 10, 2023 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute
The Advanced Future
The year 2022 might be remembered as the Year of Advanced Packaging. The Department of Defense got the ball rolling last summer with the CHIPS Act, and the IPC Advanced Packaging Symposium helped outline the hurdles we’re facing with complex packaging. So, we asked a variety of experts to discuss the challenges and trade-offs that PCB designers and design engineers are seeing today with advanced packages.
We start off this issue with an article by Kris Moyer, who focuses on the routing techniques necessitated by advanced packaging. Next, Lee Ritchey discusses a challenge that’s facing aerospace PCB designers who use stacked microvias, and he offers a variety of methods for circumventing this problem, including using staggered microvias. Columnist Tim Haag shares his take on designing complex packaging, and he tracks how complicated some designs have become over the past few decades. Ashutosh Mauskar breaks down the nearly “perfect storm” of drivers affecting the semiconductor industry and packaging trends, including supply chain issues, artificial intelligence, EVs and autonomous vehicles. And columnist John Watson explains why packaging is likely to continue shrinking and pushing Moore’s Law to its limits: “We are simply running out of room.”
We also have columns from our regular contributors Barry Olney, Matt Stevenson, Joe Fjelstad, Anaya Vardya, and Saskia Hogan. And we have articles from Zachariah Peterson and an interview with Ventec’s Alun Morgan and Mark Goodwin.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Kodiak Assembly Solutions Renews ITAR Registration, Providing Secure and Compliant Manufacturing for Defense & Aerospace
09/25/2025 | Kodiak Assembly SolutionsKodiak Assembly Solutions LLLP, a leading electronics contract manufacturer, has successfully renewed its ITAR (International Traffic in Arms Regulations) registration.
Cyient DLM, A Voice from the Frontlines
09/24/2025 | Arpita Das, Global Electronics AssociationOnce seen as a low-cost, build-to-print destination, India’s EMS sector is rapidly emerging as a global hub for high-reliability electronics, particularly in strategic sectors like aerospace, defense, and medical. As such, we highlight some companies that exemplify the strength and potential of Indian manufacturing.
Nortech Systems Achieves Enhanced Fiber Optic Performance
09/16/2025 | Nortech SystemsNortech Systems Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, announced significant advancements in its fiber optic capabilities.
Altair, Wichita State University’s NIAR Sign MoU to Accelerate Aerospace Innovation
09/16/2025 | AltairAltair, a global leader in computational intelligence, and Wichita State University’s (WSU) National Institute for Aviation Research (NIAR), one of the world’s leading aerospace research institutions, have signed a memorandum of understanding (MoU) to advance innovation across the aerospace and defense industries.
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.