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Standards Committees: Moving Faster, Working Better
January 17, 2023 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes
 
                                                                    Standards committee work is where much of the heavy lifting takes place for industry standards. To the inexperienced eye, the committee process can also seem as perplexing as it is crucial. In this conversation, Teresa Rowe, IPC’s senior director of assembly and standards technology, highlights what to expect from standards committee sessions at IPC APEX EXPO 2023. New committees, revisions, leadership, awards, and thoughtful pauses to celebrate achieving milestones are all part of the IPC APEX EXPO standards committee experience.
Nolan Johnson: Teresa, looking ahead to IPC APEX EXPO 2023’s committee work, what is meaningful and compelling for attendees?
Teresa Rowe: From a standards development perspective, we have new projects. First, we have a new project on magnification, as well as projects for Factory of the Future. We have a lot of leading-edge technologies, and we have some celebrations for the completion of some of our documents, IPC/WHMA-A-620E being one of them. We're continuing our work to release more things that industry is anxiously awaiting in 2023. It's an opportunity for us to see each other face to face and, as I like to say it, “families” getting together and having reunions.
Johnson: Is there a sense that committee work is accelerating?
Rowe: Yes. There is a demand from industry for standards to be on the top of their game and it's a well-known fact that it takes a long time for some things to get into the documents. We must look at test data; sometimes we set up tests ourselves or with the groups and work through what that means for industry. But at the end of the day, industry’s expectation is that we provide them with the standards requirements that are accepted by that same industry, so that they can build for their customers.
Johnson: Let’s walk through some of the committee work you just highlighted, such as magnification.
Rowe: We've had a standard for a very long time. It's very old; IPC-OI-645, which is referenced in one of our very popular documents. We realized that it needs to be updated. The standards group has taken an action item to start looking at the older standards in our library and to either reaffirm, revise, or withdraw them and make them obsolete. Because of the conversation with that group, they realized they also needed a guidance document that helped industry to use magnification. Things are getting smaller, and people can't see them, so there's a whole new effort with that. In addition, factory of the future has two new magnification projects for AOI and AOX and we're planning to bring those on board.
Johnson: That’s a nice segue to the factory of the future. What's happening there this year?
Rowe: We're just getting our committees formed, and sometimes the most difficult part is to get a project off the ground. We're looking for anyone who might be interested in working on these projects, those who want to dedicate their time to help themselves, their company, and industry to reach consensus on what's needed.
To read this entire conversation, which appeared in the December 2022 issue of PCB007 Magazine, click here.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
Come Together: Tom Marktscheffel Used Data to Build CFX and a Global Factory Standard
10/27/2025 | Sandy Gentry, Community MagazineWhen Tom Marktscheffel, director of product management software solutions at ASMPT, looks back on his nearly three decades in electronics manufacturing, one word stands out: data. “Data is the new gold,” he says. Without it, automation, artificial intelligence, and the factory of the future are impossible. With it, the industry can move from manual, error-prone processes to smart, connected systems that make real-time decisions.

 
                                     
                                     
                                     
                                     
                                             
                                             
                                             
                                             
                                             
                                             
                                     
                                             
                                             
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