Beyond Design: Slaying Signal Integrity Villains
Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
February 2023 Issue of Design007 Magazine Available Now
February 8, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Shrinking Silicon: A Warp Speed Facilitator
As we all learned by watching Star Trek, a lot of crazy things can happen at warp speed. There’s just no room for error at warp speed. Now, many PCB designers are dealing with increasing signal speeds and rise times, and a parliament of other effects—some positive, some negative—thanks to shrinking silicon. Not quite warp speed, but a lot of unpredictable things can happen when the die gets tiny.
So, in this issue, our expert contributors discuss the causes and effects of silicon shrinkage, including how to better manage EM strategies and signal integrity, as signal speeds and rise times continue their trek toward warp speed.
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Beyond Design: Slaying Signal Integrity Villains
09/17/2025 | Barry Olney -- Column: Beyond DesignHigh-speed PCB design is a balancing act, where subtle oversights can develop into major signal integrity nightmares. Some culprits lie dormant during early validation, only to reveal themselves later through workflow disruptions and elusive performance bottlenecks. Take crosstalk, for example. What begins as a stray signal coupling between traces can ripple through the design, ultimately destabilizing the power distribution network. Each of these troublemakers operates with signature tactics, but they also have well-known vulnerabilities.
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
September 2025 PCB007 Magazine: The Future of Advanced Materials
09/16/2025 | I-Connect007 Editorial TeamMoore’s Law is no more, and the advanced material solutions being developed to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Elementary Mr. Watson: Running the Signal Gauntlet
09/11/2025 | John Watson -- Column: Elementary, Mr. WatsonIf you’ve ever run a military obstacle course, you know it’s less “fun fitness challenge” and more “how can we inflict as much pain in the shortest time possible?” You start fresh—chest out, lungs full of confidence, thinking you might even look good doing this—and 10 seconds later, you’re questioning all your life choices.
The Shaughnessy Report: Winning the Signal Integrity Battle
09/09/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportWhen I first started covering this industry in 1999, signal integrity was the hip new thing in PCB design. Conference classes on signal integrity were packed to the walls, and an SI article was guaranteed to get a lot of reads.