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February 2023 Issue of Design007 Magazine Available Now
February 8, 2023 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
![](https://iconnect007.com/application/files/1716/9087/1040/design_0223_cover250.jpg)
Shrinking Silicon: A Warp Speed Facilitator
As we all learned by watching Star Trek, a lot of crazy things can happen at warp speed. There’s just no room for error at warp speed. Now, many PCB designers are dealing with increasing signal speeds and rise times, and a parliament of other effects—some positive, some negative—thanks to shrinking silicon. Not quite warp speed, but a lot of unpredictable things can happen when the die gets tiny.
So, in this issue, our expert contributors discuss the causes and effects of silicon shrinkage, including how to better manage EM strategies and signal integrity, as signal speeds and rise times continue their trek toward warp speed.
Suggested Items
The New Chapter: The Impact of Parasitics on PCB Design
08/28/2024 | Hannah Grace & Paige Fiet -- Column: The New ChapterThere are many considerations when planning and designing a board layout, and factors that include signal integrity, electromagnetic interference, and power integrity must be considered. Newer board designers often forget one factor crucial to a PCB’s performance and reliability, namely board parasitics, which usually refers to an unintended electrical effect in electronic components and interconnections. This can often lead to significant changes in the physical characteristics of the layout of the PCB. Typically, in board design, parasitics look similar to the length of a trace or a wire. Each trace is slightly resistive, slightly inductive, and slightly capacitive. These are commonly known as parasitic capacitance, parasitic inductance, and parasitic resistance.
Space Flight Laboratory (SFL) Confirms Successful Deployment of HawkEye 360 Microsatellite Cluster 10
08/20/2024 | BUSINESS WIRESpace Flight Laboratory (SFL) confirmed that HawkEye 360 Cluster 10 has been successfully launched and deployed in orbit. Cluster 10 brings to 30 the total number of radio frequency geolocation microsatellites developed for HawkEye 360 by SFL and is the third Cluster integrated at HawkEye 360’s Virginia facility under the SFL Flex Production Program.
Happy’s Tech Talk #31: Novel Ultra HDI Architectures
08/12/2024 | Happy Holden -- Column: Happy’s Tech TalkUltra HDI has become the focus for many fabricators, especially as the follow-on for the 40-year-old conventional HDI. But there is more to UHDI than just finer traces and spaces. Novel architectures have been developed that complement the new dense lithography. One of the major advantages of HDI, and especially ultra HDI, is the miniature features of the process. Since the microvias and lands are so small, they can be swung around at various angles between the BGA lands. The angles and distances will depend on the BGA pitch and where the microvia is placed relative to the BGA SMT land.
Real Time with… THECA 2024: State of the Art Copper Adhesion
08/09/2024 | Real Time with... THECABruce Lee, MacDermid Alpha Electronics Solutions, joined Nolan Johnson following his paper presentation on the show's mainstage. Lee provided a detailed overview of the current state of adhesion promoters and discussed the interaction between mechanical adhesion, chemical adhesion, signal integrity, and substrate impacts.
Trouble in Your Tank: Materials for PWB Fabrication—Drillability and Metallization
07/16/2024 | Michael Carano -- Column: Trouble in Your TankLaminate materials are the building blocks on which printed circuit boards are manufactured. Circuit board designers rely on the critical electrical properties of the materials to design the interconnects, and with the drive toward IoT (internet of things), autonomous driving, and virtual and augmented reality, material properties take on a very high level of importance.