- design007 Magazine
Latest IssuesCurrent Issue
Rigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
Simulation, Analysis, and AI
Getting today’s designs “right the first time” is critical, especially with costly advanced PCBs. Simulation and analysis software tools can help you in the fight to eliminate respins. They’re not magical, but they can predict the future of your design.
Advanced, Complex & Emerging Designs
This month, our contributors focus on designing PCBs with advanced, complex and emerging technologies. We investigate design strategies for boards that are on the cutting edge of technology, or crazily complex, or so new that designers are still writing the rules as they go.
- Events||| MENU
- design007 Magazine
Real Time with... IPC APEX EXPO 2023: Automotive ElectrificationFebruary 8, 2023 | Real Time with...IPC APEX EXPO
Estimated reading time: Less than a minute
Nolan Johnson talks with Senior Product Manager Chris Nash of Indium Corporation, who discusses Durafuse LT, a novel solder paste mixed alloy system with highly versatile characteristics that enable energy savings, high-reliability, low-temperature, step soldering, and assemblies with large temperature gradients. It also provides superior drop shock performance to conventional low-temperature solders, outclassing BiSn or BiSnAg alloys, and performing better than SAC305 with optimum process setup.
If you were unable to attend IPC APEX EXPO 2023, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
The practical question around CHIPS Act development and electronics assembly is, “Will this change how we do business?” Indium Corporation’s Dr. Andy Mackie sat down with Nolan Johnson to share what he sees as emerging answers to that question from his perspective as an expert in electronics assembly and packaging, and as a participant in standards development through IPC, JEDEC, and SEMI.
Nihon Superior Co. Ltd. is pleased to announce that Keith Sweatman, the company's Senior Technical Advisor, will deliver a presentation titled "A Path to Ductile Low-Temperature Solders for Mass Production of Electronic Assemblies" at the upcoming SMTA International conference and exposition.
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Kyocera International has finalized the purchase of a Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machine.
Conecsus Metals México, an innovative environmental technology and recycling company, will exhibit at the SMTA Foro Tecnico & Expo, Guadalajara, Jalisco, México, on Wednesday, October 25, 2023, beginning at 11:00 a.m.
Thermaltronics USA, Inc., a globally acclaimed manufacturer of Precision Soldering Robots and innovative Curie point soldering systems, is excited to announce its participation in the highly anticipated SMTA Guadalajara Expo & Tech Forum, scheduled to take place from October 25-26, 2023.