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SEMI Semiconductor Climate Consortium and BCG Issue First Insider Report of Semiconductor Value Chain's Carbon Emissions

09/21/2023 | SEMI
The SEMI Semiconductor Climate Consortium (SCC) issued its first report of the semiconductor ecosystem's greenhouse gas (GHG) emissions profile, an in-depth analysis of the semiconductor value chain's carbon footprint and priority-ranked carbon emission sources for the industry to address.

PDR & SMTVYS Technology to Showcase Innovative SMD/BGA Rework and X-ray Solutions at SMTA Guadalajara

09/20/2023 | PDR
PDR is set to showcase its cutting-edge IR-E3 Series of SMD/BGA IR rework systems, as well as its industry-leading X-ray solutions.

Hentec Industries/RPS Automation Expands Assembly Team with Addition of Experienced Technician

09/20/2023 | Hentec Industries/RPS Automation
Hentec Industries/RPS Automation, a leading manufacturer of selective soldering, component lead tinning and solderability test equipment, announces that it has added assembly and production staff members to its team to accommodate its recent increase in sales and order demand.

Austin American Technology's Justin Cody Worden to Guest Host Exclusive Interviews at SMTA International 2023

09/20/2023 | Austin American Technology (AAT)
Austin American Technology (AAT) is proud to announce its pivotal role as a key sponsor for the on-camera interviews conducted by Justin Cody Worden for What's New in Electronics (WNIE) at SMTA International 2023, October 10-11 in Minneapolis, MN.

Nolan's Notes: Convergence

09/19/2023 | Nolan Johnson -- Column: Nolan's Notes
When I stop to consider the dynamics in our industry at this moment, I keep coming back to the idea of “convergence.” Aspects of our industry historically thought of as distinct and separate are blurring the lines and overlapping. As I look back on our coverage in the past five years, I see convergence taking place, moving like a glacier—slow and steady but with formidable force. In this issue of PCB007 Magazine, the three areas of convergence we consider are materials, advanced packaging, and UHDI.
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