Real Time with... IPC APEX EXPO 2023: DART NextGen TechnologyFebruary 15, 2023 | Real Time with...IPC APEX EXPO
Estimated reading time: Less than a minute
Brendan Hogan from MivaTek Global describes recent developments in direct imaging technology, particularly the capability to achieve on-the-fly scaling and feature-size control with digital adaptive rasterization technology (DART).
If you were unable to attend IPC APEX EXPO 2023, don't worry. We're bringing you coverage of the week's events in San Diego, from ribbon cutting to teardown.
Watch this interview below or click here to view on our Real Time with... IPC APEX EXPO show page.
The Semiconductor Industry Association (SIA) announced Geoff Martha, chairman and CEO of healthcare technology leader Medtronic, will be the keynote presenter at the 2023 SIA Awards Dinner on Thursday, Nov. 16 in San Jose, Calif.
Despite being a leader in R&D investment in semiconductors and packaging with greater than $50 billion per year, the U.S. has seen its market share decrease to less than 3% in areas like advanced packaging and advanced substrates. The cause for this market share erosion was a laser focus in Asian countries to attract semiconductors and advanced packaging investment through ecosystem development and incentives. If the U.S. is serious about changing the momentum to onshore advanced packaging and advanced substrates, an ecosystem approach to innovation and manufacturing incentives must be employed. It is not enough to have the most innovative technology if the supply chain and manufacturing economics do not deliver competitive commercial opportunities.
StenTech Inc., the leading multinational SMT Printing Solutions company, is pleased to announce plans to exhibit at the SMTA Guadalajara Expo, scheduled to take place Oct. 25-26, 2023 at the Expo Guadalajara in Guadalajara, Jalisco, Mexico.
Nanofiber Quantum Technologies Inc. raised $8.5m from leading venture capital investors. Phoenix Venture Partners (PvP) in the US, and Japan's JAFCO Group Co Ltd, SPARX Group Co Ltd, Keio Innovation Initiative, Inc. (KII), and Waseda University Ventures (WUV) financed the round through convertible notes.
Despite what some seem to believe, rigid-flex circuits are not a new technology. In fact, they are more than a half-century old. At the time of the invention, my friend Thomas Sterns was working at Sanders Associates, the pioneering flex circuit manufacturer. Like many products in the first decades of printed circuit technology, they were working on a military application. The objective was to provide a reliable method for reducing the size, bulk, weight, and questionable reliability of wire harness assemblies while simultaneously reducing cost and assuring that human error might be minimized. These were all vitally important concerns for military and aerospace products.