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Three Things to Improve High-Speed PCB Signoff, Part 2

09/27/2023 | Brad Griffin, Cadence Design Systems
Another challenge for SerDes is losses within the channel design. At high speeds, dielectric material can be very lossy, making the appropriate selection of the right material, length, etc., critical for the channel. Many questions about stackup, trace widths, and height from the ground plane need to be defined up front. Simulating a signal with a topology explorer tool extracted from the design can be used to set up and run sweep parameters and push min/max length/spacing values into the Allegro schematic constraint manager (system capture).

Keysight EDA 2024 Integrated Software Tools Shift Left Design Cycles to Increase Engineering Productivity

09/27/2023 | Keysight Technologies, Inc.
Keysight Technologies, Inc. introduces Keysight EDA 2024, a tightly integrated suite of electronic design automation (EDA) software tools that ensures first pass success.

Pivoting on Substrates

09/27/2023 | I-Connect007 Editorial Team
Oved Shapira is CEO of PCB Technologies, the Israeli-based printed circuit provider. PCB Technologies has recently invested in facilities and expertise to design, fabricate, and assemble substrates, a key component for advanced packaging technologies. Oved spoke with Barry Matties and Nolan Johnson about how advanced packaging will influence the industry. He said it will shift everything, including design, fabrication, assembly techniques, and capital equipment development. Some of these shifts might be subtle, and others more seismic. Whatever the changes, Oved says it’s coming.

Transition Automation Updates Innovative Paste Retainers

09/27/2023 | Transition Automation, Inc.
Transition Automation, Inc. has improved the unique Paste Retainer System that is included in the company’s line of squeegee holder systems.

Cadence Custom/Analog Design Migration Flow Accelerates Adoption of TSMC Advanced Process Technologies

09/26/2023 | Cadence Design Systems, Inc.
Cadence Design Systems, Inc. announced the expansion of its node-to-node design migration flow based on the Cadence® Virtuoso® Studio, which is compatible with all TSMC advanced nodes, including the latest N3E and N2 process technologies.
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