Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Cephia Secures $4M Seed Funding to Revolutionize Multimodal Sensing with Metasurface Technology

10/31/2025 | PRNewswire
Cephia, a startup building products using advanced AI computational imaging technologies and silicon sensors made from advanced metamaterials, formally launched with several pilot customers and $4 million in seed venture capital funding.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/31/2025 | Nolan Johnson, I-Connect007
Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.

NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration

10/31/2025 | NEDME
The NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.

The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver

10/30/2025 | The Training Connection LLC
The Training Connection, LLC (TTC-LLC), a premier provider of test engineering and development training, is proud to announce the addition of Bill Graver to its growing team of industry experts. A respected professional with more than 35 years in electronics manufacturing, Bill joins as an IPC Master Trainer, bringing a wealth of hands-on experience in PCB testing, failure analysis, and process improvement.

I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC

10/30/2025 | I-Connect007
I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in