Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
Target Condition: The 5 Ws of PCB Design Constraints
Fresh PCB Concepts: More Than Compliance—A Human-centered Sustainability Approach
LogicSwap Solutions' Software Converts Third-party PCB Design Data to eCADSTAR
April 11, 2023 | ZukenEstimated reading time: Less than a minute
LogicSwap Solutions, a US-based company specializing in data migration software for the EDA industry, is now offering a free data conversion package to transfer third-party PCB design data to Zuken’s eCADSTAR format. The software enables eCADSTAR users to utilize Altium Designer library, schematic, and PCB design data for design, analysis, and manufacturing within the eCADSTAR toolset.
The free Altium Designer to eCADSTAR conversion software from LogicSwap is available today and recommended by the eCADSTAR team. Software and support are provided directly by LogicSwap Solutions.
The eCADSTAR tool is Zuken’s PCB design solution for small and medium companies looking for high performance at a low cost. eCADSTAR delivers a complete 2D/3D PCB design process, including web part import, SI/PI analysis, and IPC-2581 manufacturing outputs.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Statement from the Global Electronics Association on the July 2025 Tariff on Copper Foil and Electronics-Grade Copper Inputs
07/31/2025 | Global Electronics AssociationWe are disappointed by today’s decision to impose a 50% tariff on imported copper foil and other essential materials critical to electronics manufacturing in the United States.
LQDX Inc. Completes Sale of Aluminum Clad Laminate IP to Toyo Aluminium K.K.
07/31/2025 | PR NewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has completed the divestiture of its Aluminum Clad Laminate IP – known as ACL™ – to Toyo Aluminium K.K., a Japan-based global market leader in specialty aluminum-based products for the consumer, electronics and automotive sectors.
Federal Electronics Mexico Enhances SMT Line with Installation of Heller Industries Reflow Oven
08/01/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its surface mount technology (SMT) operations with the installation of a new Heller Industries reflow oven at its facility in Hermosillo. This upgrade supports the company’s continued growth in high-reliability markets such as aerospace, medical, industrial, and instrumentation.
Hon Hai Technology Group (Foxconn) and TECO Announce Strategic Alliance Targeting AI Data Center Capabilities
07/31/2025 | Hon Hai Technology GroupHon Hai Technology Group (“Foxconn”) and TECO Electric & Machinery Co Ltd (“TECO”) on Wednesday announced a share exchange, strategic alliance that will strengthen their AI infrastructure capabilities and propel the two Taiwanese tech majors into key markets in the global super-computing race.
Considering the Future of Impending Copper Tariffs
07/30/2025 | I-Connect007 Editorial TeamThe Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.