-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Cadence Introduces EMX Designer
April 14, 2023 | Cadence Design Systems, Inc.Estimated reading time: 2 minutes

Cadence Design Systems, Inc. announced the new Cadence® EMX® Designer, a passive device synthesis and optimization technology that delivers, in split seconds, design rule check (DRC)-clean parametric cells (PCells) and accurate electromagnetic (EM) models of passive devices, such as inductors, transformers, T-coils and more. Seamlessly integrated with the Cadence Virtuoso® ADE Product Suite, the EMX Designer solution offers more than 10X faster synthesis times, with significant productivity gains versus other solutions.
The EMX Designer solution lets customers rapidly synthesize DRC-clean passive devices at a touch of a button, based on electrical and geometrical requirements. With unparalleled flexibility, EMX Designer PCells can easily be modified to meet the designers’ exact layout requirements, utilizing a long list of options from a user-friendly interface inside the Virtuoso platform. When used with the EMX 3D Planar Solver, the industry’s gold-standard electromagnetic modeling engine, the EMX Designer solution ensures the accuracy of generated models. The seamless integration with the Virtuoso platform offers users various options for plotting and appending results.
“pSemi evaluated the Cadence EMX Designer solution as we were interested in automating the passive device creation and optimization process for our proprietary PDKs,” said John Sung, Vice President of Engineering Infrastructure at pSemi. “EMX Designer fully met our requirements for PCell flexibility, speed and accuracy. It is seamlessly integrated into the Cadence design flow and will improve the productivity of our design teams.”
“The new EMX Designer solution adds key technology to our leading Custom IC design flow, delivering the most flexible passive-device PCells in record-breaking time while also enabling significant productivity gains,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group at Cadence. “We are pleased to offer our customers an expanded, complete, highly differentiated and efficient IC design platform that addresses the early stages of the design all the way through to signoff and closure.”
“Using Cadence’s new EMX Designer solution, our team was able to improve productivity and reduce design cycle times,” said Peter Gammel, CEO, Ubilite. “We managed to synthesize passive devices with better performance, and at the same time, save 20% silicon area for the advanced process nodes we use with the new solution. EMX Designer offers us a versatile library of passive devices, delivering extremely accurate results across all process nodes at incredibly fast speeds.”
The EMX Designer solution seamlessly interfaces with Cadence EMX 3D Planar Solver and further supports the Cadence Intelligent System Design™ strategy, enabling system-on-chip (SoC) design excellence and system innovation.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Staying on Top of Signal Integrity Challenges
09/16/2025 | Andy Shaughnessy, Design007 MagazineOver the years, Kris Moyer has taught a variety of advanced PCB design classes, both online IPC courses and in-person classes at California State University-Sacramento, where he earned his degrees in electrical engineering. Much of his advanced curriculum focuses on signal integrity, so we asked Kris to discuss the trends he’s seeing in signal integrity today, the SI challenges facing PCB designers, and his go-to techniques for controlling or completely eliminating SI problems.
ASM Technologies Limited signs MoU with the Guidance, Government of Tamilnadu to Expand Design-Led Manufacturing capabilities for ESDM
09/15/2025 | ASM TechnologiesASM Technologies Limited, a pioneer in Design- Led Manufacturing in the semiconductor and automotive industries, announced signing of Memorandum of Understanding (MoU) with the Guidance, Government of Tamilnadu whereby it will invest Rs. 250 crores in the state to expand its ESDM related Design-Led Manufacturing and precision engineering capacity. ASM Technologies will acquire 5 acres of land from the Government of Tamilnadu to set up a state-of-the-art design facility in Tamil Nadu's growing technology manufacturing ecosystem, providing a strong strategic advantage and long-term benefits for ASM.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Deca, Silicon Storage Technology Announce Strategic Collaboration to Enable NVM Chiplet Solutions
09/11/2025 | Microchip Technology Inc.As traditional monolithic chip designs grow in complexity and increase in cost, the interest and adoption of chiplet technology in the semiconductor industry also increases.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).