Standard of Excellence: Speed vs. Quality in Customer Service
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
Pemtron Wins 2023 EM Innovation Award for Its TWIN 3D AOI System
April 14, 2023 | Pemtron TechnologyEstimated reading time: 1 minute
Pemtron Technology, an inspection equipment developer and supplier, is pleased to announce that it received a 2023 EM Innovation Award in the category of Inspection – AOI for its EAGLE 3D 8800 TWIN 3D Automated Optical Inspection system. The award was announced at a ceremony that took place April 14, 2023 during productronica China in Shanghai.
Steven Wongsonvanee, Pemtron General Manager – Americas, stated, “I am honored to announce that Pemtron has won the 2023 EM Innovation Award for the TWIN 3D AOI System. This cutting-edge technology represents a major step forward in automated optical inspection.”
The EAGLE 3D 8800 TWIN AOI uses 12-way projection on both sides for 3D measurements on all models to minimize errors due to shadow effects and performs 100% 2D & 3D concurrently in all FOV areas. This significantly reduces false calls while providing near-perfect detection. With the TWIN, Pemtron introduces Top/Bottom Double Sided simultaneous inspection. Pemtron’s new head type has been upgraded from the existing head for 3D formation that is identical to the real image and is more stable based on the accumulated technology for decades.
Established in 2006, the EM Innovation Awards program strives to recognize and celebrate excellence in the Asian electronics industry, inspiring companies to achieve the highest standards and push the industry forward.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.
SMTAI 2025 Review: Reflecting on a Pragmatic and Forward-looking Industry
10/27/2025 | Marcy LaRont, I-Connect007Leaving the show floor on the final afternoon of SMTA International last week in Rosemont, Illinois, it was clear that the show remains a grounded, technically driven event that delivers a solid program, good networking, and an easy space to commune with industry colleagues and meet with customers.
Come Together: Tom Marktscheffel Used Data to Build CFX and a Global Factory Standard
10/27/2025 | Sandy Gentry, Community MagazineWhen Tom Marktscheffel, director of product management software solutions at ASMPT, looks back on his nearly three decades in electronics manufacturing, one word stands out: data. “Data is the new gold,” he says. Without it, automation, artificial intelligence, and the factory of the future are impossible. With it, the industry can move from manual, error-prone processes to smart, connected systems that make real-time decisions.