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Rigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
Simulation, Analysis, and AI
Getting today’s designs “right the first time” is critical, especially with costly advanced PCBs. Simulation and analysis software tools can help you in the fight to eliminate respins. They’re not magical, but they can predict the future of your design.
Advanced, Complex & Emerging Designs
This month, our contributors focus on designing PCBs with advanced, complex and emerging technologies. We investigate design strategies for boards that are on the cutting edge of technology, or crazily complex, or so new that designers are still writing the rules as they go.
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June 2023 Issue of Design007 Magazine Available NowJune 8, 2023 | I-Connect007 Editorial Team
Estimated reading time: Less than a minute
Top Design Challenges
In this month’s Design007 Magazine, we share the top PCB design challenges from a variety of viewpoints—PCB designers, fabricators and assembly providers. The three challenges most often cited by contributors revolve around DFM, communication, and data—all of which are interrelated. We think you’ll find this compilation of design challenges useful.
Wondering why there is a tortoise on the cover of this issue? Well, if you recall one of the most popular Aesop’s Fables, The Tortoise and the Hare, the slow and steady reptile beat his much faster opponent by taking his time and persevering. Judging from what our expert contributors have to say in this issue, many PCB design problems could be precluded if designers simply took their time. (Yes, designers even called themselves out for this faux pas!)
Cadence Design Systems, Inc. and CEVA, Inc. announced that Cadence has completed its acquisition of Intrinsix Corporation from CEVA.
Based on the wisdom of 50 years of PCB manufacturing at Sunstone Circuits, this book is a must-have reference for designers understanding the PCB manufacturing process as it relates to their design. Designing for manufacturability requires understanding the production process fundamentals and factors within the process that often lead to variations in manufacturability, reliability, and cost of the board.
This week’s must-reads cover a little bit of everything: advanced packaging substrates, rigid-flex design, the potential loss of tribal knowledge, ultra HDI processing, and the need for fabricators to begin utilizing Smart systems. In a few weeks, we’ll be attending SMTA International in Minneapolis, and then productronica in Munich. We hope to see you on the road!
Siemens, TSMC Collaborate to Help Mutual Customers Optimize Designs Using Foundry's Newest Advancements09/29/2023 | Siemens
Siemens Digital Industries Software announced new certifications and collaborations with longtime partner TSMC, resulting in the successful qualification of multiple industry-leading Siemens EDA product lines for the foundry’s latest process technologies.
Cadence Design Systems, Inc. announced the availability of new system prototyping flows based on the Cadence® Integrity™ 3D-IC Platform that support the 3Dblox 2.0 standard.