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Ventec to Showcase Latest PCB Materials for High-end RF, Microwave Applications at IMS 2023June 8, 2023 | Ventec
Estimated reading time: 1 minute
Ventec International Group Co., Ltd., will be exhibiting at the International Microwave Symposium 2023 in San Diego from June 13-15. On booth 2343, Ventec will be showcasing its unique range of PCB laminates and prepreg materials for high-end RF and microwave applications - all supported by a fast and efficient global delivery promise through Ventec's fully controlled and managed global supply chain and world-class dependable technical support.
Ventec’s tec-speed range comprises an enhanced set of high-performance, high-reliability, and high-frequency solutions developed for the demands of the RF and microwave industries. At the exhibition, visitors will be invited to explore the latest additions to the central tec-speed 20.0 range, including:
- New VTM-1000i, Ventec’s latest hydrocarbon laminate with excellent thermal reliability and incredibly high Dk (9.8) and low Df (0.0023). VTM-1000i represents the top-tier option for use with satellite communications systems, GPS antennas, and other RF and microwave circuitry.
- New VT-870 L330x, a low-cost hydrocarbon solution for mmWave radar with 3.25 Dk and 0.0030 Df, designed specifically for use with automotive radar designs.
Further high-speed, low-loss materials highlighted at the booth include:
tec-speed 30.0 – Ventec’s ceramic-filled PTFE material range is designed for high-speed/high-frequency applications. It offers the highest signal-integrity characteristics to offer premium quality for the most advanced systems, such the demanding arena of 77~79 GHz automotive radar.
tec-thermal - The tec-thermal range comprises Ventec's IMS (Insulated Metal Substrate) families, laminates and prepregs for multilayer PCBs specifically developed for excellent thermal performance. Experts will be available at the exhibition to discuss the range of innovative formulas that features:
VT-4B5 SP - an aluminum base laminate that ensures maximum thermal efficiency for direct-to-metal connections of electrically isolated heat sources and places dielectric insulation only where needed.
VT-4B5L - a high-performance IMS material that offers excellent solder joint reliability and thermal conductivity of 3.6 W/mK.
Ventec’s range of laminates and prepregs include product lines optimized for superior signal integrity and high-speed digital applications, RF and analog circuits, thermally enhanced materials including insulated metal substrate (IMS) technology, and an advanced range of thermal management solutions. The company serves customers across the globe, active in industries including automotive, communication, aerospace, and defense.
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its new NC259FPA Ultrafine No Clean Solder Paste, which it revealed recently during the Productronica Germany trade show.
Real Time with... productronica 2023: Koh Young Discusses Semiconductor and Advanced Packaging Inspection11/27/2023 | Real Time with...productronica
Koh Young’s Harald Eppinger talks about the company’s technology for the semiconductor and advanced packaging market and how they address the challenges introduced by reflective components and micro solder deposits.
HyRel Technologies Attains ITAR Registration, Reinforcing Leadership in Robotic Solder Component Tinning11/27/2023 | HyRel
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, announces the achievement of International Traffic in Arms Regulations (ITAR) registration.
Mek (Marantz Electronics), a leader in Automated Optical Inspection (AOI) solutions, used last weeks’ Productronica show in Munich to proudly introduce the SpectorBOX X series, a modular full 3D AOI system for THT solder joints and THT components.
Productronica 2023 played host to the IPC World Hand Soldering Competition, bringing talented regional solder champions from all over the globe to compete for the title of World Champion. Each competitor was given sixty minutes to assemble a complex printed circuit board with their performance judged in accordance with IPC-A-610 Class 3 criteria. Each competitor’s efforts were rated on the merits of the results achieved, scored on the quality of the assembly process, the electrical functionality of the assembly and the speed at which the assembly was produced.