Connect the Dots: Best Practices for Prototyping
Designer’s Notebook: DFM Principles for Flexible Circuits
Elementary, Mr. Watson: Flex Designs—The Future and BeyondVentec to Showcase Latest PCB Materials for High-end RF, Microwave Applications at IMS 2023
June 8, 2023 | VentecEstimated reading time: 1 minute
Ventec International Group Co., Ltd., will be exhibiting at the International Microwave Symposium 2023 in San Diego from June 13-15. On booth 2343, Ventec will be showcasing its unique range of PCB laminates and prepreg materials for high-end RF and microwave applications - all supported by a fast and efficient global delivery promise through Ventec's fully controlled and managed global supply chain and world-class dependable technical support.
Ventec’s tec-speed range comprises an enhanced set of high-performance, high-reliability, and high-frequency solutions developed for the demands of the RF and microwave industries. At the exhibition, visitors will be invited to explore the latest additions to the central tec-speed 20.0 range, including:
- New VTM-1000i, Ventec’s latest hydrocarbon laminate with excellent thermal reliability and incredibly high Dk (9.8) and low Df (0.0023). VTM-1000i represents the top-tier option for use with satellite communications systems, GPS antennas, and other RF and microwave circuitry.
- New VT-870 L330x, a low-cost hydrocarbon solution for mmWave radar with 3.25 Dk and 0.0030 Df, designed specifically for use with automotive radar designs.
Further high-speed, low-loss materials highlighted at the booth include:
tec-speed 30.0 – Ventec’s ceramic-filled PTFE material range is designed for high-speed/high-frequency applications. It offers the highest signal-integrity characteristics to offer premium quality for the most advanced systems, such the demanding arena of 77~79 GHz automotive radar.
tec-thermal - The tec-thermal range comprises Ventec's IMS (Insulated Metal Substrate) families, laminates and prepregs for multilayer PCBs specifically developed for excellent thermal performance. Experts will be available at the exhibition to discuss the range of innovative formulas that features:
VT-4B5 SP - an aluminum base laminate that ensures maximum thermal efficiency for direct-to-metal connections of electrically isolated heat sources and places dielectric insulation only where needed.
VT-4B5L - a high-performance IMS material that offers excellent solder joint reliability and thermal conductivity of 3.6 W/mK.
Ventec’s range of laminates and prepregs include product lines optimized for superior signal integrity and high-speed digital applications, RF and analog circuits, thermally enhanced materials including insulated metal substrate (IMS) technology, and an advanced range of thermal management solutions. The company serves customers across the globe, active in industries including automotive, communication, aerospace, and defense.
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