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IPC Welcomes U.S. House Veteran Rich Cappetto as Senior Director of North American Government Relations
August 22, 2023 | IPCEstimated reading time: 1 minute
IPC welcomes Richard Cappetto, a 14-year veteran of the U.S. House of Representatives, as its new senior director for North American government relations.
In this role, Cappetto will be responsible for the development and implementation of IPC’s public policy advocacy efforts in the United States, Canada, and Mexico. He will work closely with key government officials and their staffs; with IPC’s Government Relations Steering Committee and its Advocacy Team, composed of senior executives and staff of IPC member companies; and with IPC’s professional staff worldwide to advocate on behalf of the electronics industry in the halls of government. IPC’s policy priorities include securing funding and incentives for investment and innovation in electronics manufacturing; ensuring practical, risk-based regulations; and expanding efforts to educate and train more high-skilled workers.
Cappetto’s prior role was Chief Customer Officer in the U.S. House, where he worked to improve internal services to all Members of Congress and their staffs, so that they could better serve their constituents. Previously he was staff director of the Commission on Congressional Mailing Standards and a professional staff member at the Committee on House Administration. He holds a bachelor’s degree from Central Michigan University; a master’s degree in defense and strategic studies from the U.S. Naval War College; and a certificate in public sector leadership from Cornell University. He is a certified project management professional (PMP) and contracting officer’s representative.
“Rich’s expertise in congressional affairs and his extensive relationships on Capitol Hill will enable him to be a trusted, effective advocate for IPC members in Washington, Ottawa, Mexico City, and across the globe,” said Chris Mitchell, IPC vice president of global government relations.
Cappetto is the latest in a string of new hires and promotions in IPC’s Washington office. Michelle Mermelstein recently joined IPC as senior director of media engagement; Nyron Rouse as director of government grants and strategic funding initiatives; and Kate Koger as public affairs coordinator. The entire team and the IPC advocacy agenda can be found on IPC’s Advocacy pages.
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IPC CFX Demo Line Debuts in Korea at EMK 2026
04/10/2026 | Global Electronics AssociationAt Electronics Manufacturing Korea (EMK) x NEPCON Korea 2026, the Global Electronics Association, in collaboration with 13 companies, showcased the IPC CFX Demo Line (Connected Factory Exchange demonstration line), marking its debut in Korea.
IPC-7712 Development Advances at APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities
04/10/2026 | Circuit Technology Center, Inc.Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at APEX EXPO, March 16 to 18.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.
IPC Masters Competition China 2026 Unveils Winners, Empowering Advanced Talent Development in Electronics Manufacturing
04/01/2026 | Global Electronics AssociationOn March 25–27, the IPC Masters Competition China was held in Pudong, Shanghai. This year’s competition brought together 623 leading professionals in the electronics industry from 21 provinces and municipalities.
Global Electronics Association, MIMOS Berhad Sign MoU to Advance Malaysia’s Electronics and Semiconductor Ecosystem
03/31/2026 | Global Electronics AssociationThe Global Electronics Association and MIMOS Berhad recently signed a Memorandum of Understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.