Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Connect the Dots: Involving Manufacturers Earlier Prevents Downstream Issues
Global PCB Connections: The Next Wave of HDI PCBs– How Design Engineers Can Stay Ahead
