More Productronica Highlights

Estimated reading time: 6 minutes

Marantz, Juki, Pickering Interfaces, DKN Research, Aegis, Palomar, BTU Europe, Asymtek, Ovation, Kester, Lloyd Doyle, Inovaxe, BPM, EVS, KIC, VJ Electronix, Kyzen, RMD, and Balver Zinn will launch products from aqueous cleaning chemistries to AOI systems, components, XRF analyzers, solder pastes, programmers, and more at Productronica, November 1316 in Munich, Germany.

Marantz Business Electronics will showcase 24-bit color imaging defect detection on all of its AOI systems. The technology reportedly minimizes false alarms and downtime. M22XDL-460 benchtop AOI handles 460- × 360-mm PCBs. L22XDL-520 is an in-line AOI machine with faster programming and 24/7 operation. It supports detailed PCB inspection, including SMT and thru-hole components, reflow and wave solder joints, and solder paste. The company also will display its M22XDL-350, with the smallest footprint of Marantz's desktop AOI systems. Hall A4, Booth 380.

Pickering Interfaces will alert attendees to its LXImate, which describes the LXI standard and its benefits. The company also will launch dedicated optical multiplexers controlled through the LXI interface: the 60-850 and 60-851. The 60-200 remote AC power management switch and a range of RF cards, the 40-870 series, will be released at the show. Hall A1, Booth 439.

Aegis Software will demonstrate an enterprise manufacturing information system as a complement to ERP/PLM, during the continental rollout of Aegis Version 7. The enterprise manufacturing system is said to accelerate processing from design release to production run with process planning, traceability, and other functions. Hall A5, Booth 101.

Palomar Technologies will introduce Palomar Microelectronics to Europe. The division is a packaging services unit created by the growing demand for quick-turn product development, prototyping, test, and assembly services. The company also will feature its Model 8000 high-throughput, automated wire bonding and ball bumping system. Hall B5, Booth 158.

Asymtek will debut Select Coat SL-940E, a high-speed, high-accuracy conformal coating system with advanced integrated software, closed-loop process controls, traceability, and an optional vision system. It also will launch Spectrum S-920 and S-910 dispensers. The S-920 high-volume dispense system uses a flexible, scalable configuration; single or dual lanes; and one, two, or three heat stations. The S-910 series is scalable for high-volume dispensing applications that do not require heat. It also boasts single- or dual-lane processing. Both systems can be upgraded in the field. Hall A4, Booth 340.

BTU Europe will launch the Pyramax 100 eight-zone air (100A) or low-consumption nitrogen (100N) series for lead-free. Proprietary closed-loop convection control is built into the forced impingement convection oven, with side-to-side air/gas recirculation to enhance temperature uniformity. It runs at 350°C maximum temperature and uses a closed-loop water cooling system with a sliding heat exchanger assembly. The company's flux management system traps flux from the process chamber, with multiple extraction location, and accessible filtration and trap. Bundled features also include WINCON Control software, smart product tracking, belt and rail conveyors with fine mesh belts, high power heaters, retractable center support, and other elements. Hall A4, Booth 141.

Ovation Products will introduce the high-density (HD) Grid-Lok automated tooling system designed to support the entire PCB assembly. Its 12-mm pin pitch can be setup quickly for complete and flexible board support. The tooling system suits high-changeover manufacturing environments. It conforms to any given board profile and individual substrate topographies, with pins automatically locked into position. The company also plans to highlight its Magna-Print universal SMT squeegee system. Hall A4, Booth 431.

Lloyd Doyle will showcase IBIS, an interferometric bump inspections system. It offers production-volume solder bump inspection on chip carriers, including position, height, and shape of coined and non-coined solder bumps. It scans up to 3,000 devices per hour using massively parallel digital signal processing technology and white light interferometry. Hall A1, Booth 347.

Kester will launch EnviroMark 919G (EM919G) lead-free solder paste for high-reliability and low-defect assembly. The no-clean paste is halide- and halogen-free, and is said to offer low voiding, lighter flux residue color, shiny joints, high solderability, and easier residue penetration. It is printable to 0.4-mm pitch, with reportedly stable tack. Cold and hot slump resistance suits lead-free reflow profiles. Hall A4, Booth 363.

Juki Corporation will demonstrate the KE-2080 high-speed flexible mounter, which includes an updated head design with six nozzles and a separate head that places components from an upward-looking camera post-inspection. Sixth-generation, the modular system includes magnascale resolution down to 1 µm, an LNC-60 high-resolution laser centering system, and one piece single-cast base. It is capable of placing 01005s. Juki also plans to highlight its KE-2070 high-speed chip shooter. Hall A5, Booth 143.

Inovaxe Corp. will exhibit a two-bay INOCART material handling system, INOCART-2BAY, in representative Fix Trade BV's booth. Hall A2, Booth 105.

BPM Microsystems will display the 3000FS Flashstream automated programming technology, designed to solve excessive programming times in in-system, JTAG, and in-circuit (ICT) methods. It is modeled on BPM's 3710 handler and contains four Flashstream programming sites. It is rated at 1050 devices per hour, handling parts in tray, tube, or tape for input or output. BPM also will display the HelixFS, modeled after the BPM Helix tabletop handling system, its manual Flashstream, and universal device programmers. At PB-Technik's booth, Hall A4, Booth 380.

Marybeth Allen, GM, KIC International Sales Inc. European Operations, will present on November 15 in Hall 6, Booth 421, discussing benefits of using less electricity in reflow ovens and wave solder machines. She will discuss three studies in EMS factories, thermal process optimization software, product functionality, research methodology, and study results. KIC also will exhibit its KIC Vision automatic profiling system and KIC Explorer thermal profiler. Hall A5, Booth 134.

Kyzen Corporation will display AQUANOX A4625B aqueous chemistry for batch washers. It removes all flux residue types, including lead-free. Environmentally friendly, it is used at low concentrations, is non-flammable and non-corrosive, and is a biodegradable low-VOC aqueous solution containing no CFCs or HAPs. Hall A4, Booth 126.

Solder post-processing with the EVS recovery systemEVS plans to unveil the EVS 1000 solder recovery system a smaller, lighter version of the EVS 3000/6000. The smaller size and footprint provide a 10-lb. or 5-kg dross capacity. It is designed for users requiring fast cycle time, using nitrogen, or running one to two wave systems. Hall A3, Booth 544.

VJ Electronix Inc. will display the Summit 1100HR high-performance, semiautomatic rework system. The company also will have its Vertex series-A X-ray inspection system at Ryonics' booth. Hall A5, Booth 324.

RMD Instruments LLC will exhibit its LeadTracer-RoHS XRF system, with new sample preparation stand. The system targets mixed assembly, high reliability, and lead-free assembly situations that require composition verification of components, devices, and PCBs. The next-generation system includes an ergonomically designed stand with "quick disconnect" grip for portable or benchtop operation. Hall A4, Booth 339.

Balver Zinn will co-sponsor the "Process Advice and Defect Clinic" run by Bob Willis. The clinic, Hall A4, Booth 146, will provide free, practical, and unbiased process advice and consultancy on common process problems, RoHS compliance, and field failures. Visitors can bring in components and assemblies for analysis and diagnoses by Bob Willis. Email questions and issues to bob@bobwillis.co.uk. Balver Zinn's SN100C lead-free fluxBalver Zinn also will display its range of solder paste, solder fluxes, and related products, including the SN100C lead-free solder range. Hall A3, Booth 478.

DKN Research will discuss its next-generation film-based connectors and printable flexible electronics. The film base connector provides small-space interconnections with high-density flexible circuits. Micro-bump arrays built on thin-film substrates reduce the thickness of the connection height to 300 µm for more than 100 pins. The technology suits end products such as cell phones and digital cameras. The flexible printed electronics feature 30-µm line and space patterns, via holes smaller than 80 µm in diameter, and embedded active and passive components. Multiple screen printing processes and advanced polyimide and polyethylene naphthalate films enable the technology. Samples; information in English and Japanese; and interpreters for German, French, Dutch, Finish, Swedish, and other languages will be on hand. Holders Technology, Hall B3, Booth 411.