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Effective Characteristic ImpedanceMarch 4, 2015 | Kirk Fabbri, KSPT Engineering Consulting
Estimated reading time: Less than a minute
In a typical interconnect, there lie multiple places where capacitance plays a factor in the signal integrity. This includes the driver and receiver output/input capacitance, as well as the packages, vias, and the transmission lines. Failing to optimize these parameters can often lead to unwanted reflections, excessive radiated and or conducted emissions, and sometimes failure of components and systems.
Reflections can occur anytime there is an impedance mismatch on the line. Sources of mismatches are plentiful and include trace width changes, vias, stubs, reference plane changes, and even the so-called fiber weave effect. In this case, a trace can encounter a different dielectric constant depending on whether it is routed over glass or the epoxy resin in the dielectric material.
In this investigation, it is the capacitive contribution of the different components that are of interest, and how they affect the characteristic impedance the driver sees.
To read the rest of this article, click here.
The asset transfer acquisition will bring Bliley's equipment, people, and IP under the KYOCERA AVX umbrella and allow KYOCERA AVX to produce the same high-quality electronic components that made Bliley a global leader.
Rigid-flex circuits are unique structures; part rigid board and part flex, they’re increasingly working their way into many of the electronic devices we use every day. There have been many advances in rigid-flex lately as more companies find themselves exploring this technology. So, before I started writing this article about rigid-flex design, I double-checked a few things. Fortunately, there is plenty of rigid-flex information available on a variety of great websites that we all know and trust.
Koh Young’s Brent Fischthal explains how UHDI and advanced packaging are challenging inspection systems. He says the shift toward larger components and advanced packaging brings a host of challenges that impact the industry. These challenges include complexity, density, package diversity, and inspection methodologies, all of which necessitate a more innovative approach.
Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, is pleased to announce a special sale on the McDry DXU-580UF Feeder Storage Cabinet.
Can digital and/or high throughput manufacturing be applied to circuit boards? Can stretchable electronics be produced without sacrificing processing capabilities?