Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
Beyond Design: The Metamorphosis of the PCB Router
Polar Talks Impedance and Insertion Loss Testing
May 29, 2015 | Real Time with...IPCEstimated reading time: Less than a minute
Product Specialists Michael Bode and Geoffrey Hazlett join Guest Editor Dan Feinberg to talk about the company and its products and solutions. They also talked about some of the technologies being enabled by the company, including controlled impedance and insertion loss testing.
Share on:
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/30/2025 | Andy Shaughnessy, Design007I don’t have a scorecard, but I do have a weekly wrap-up of must-reads that I think deserve another “bite of the apple,” so to speak. IPC’s Rich Cappetto shares his perspective on everything from tariffs to the CHIPS Act. Columnist Josh Casper discusses the use of AI in 3D AOI systems and the immediate benefits that AI can bring about. Columnist Anaya Vardya explains how technologies like AI can improve our customer service, as well as our manufacturing processes.
Connect the Dots: Proactive Controlled Impedance
05/29/2025 | Matt Stevenson -- Column: Connect the DotsFrom data centers to smartphones, designers know that the ohms have it. Getting impedance right ensures all-important signal integrity and delivers high-performing boards. Our designers understand the importance of controlled impedance, but not everyone addresses it in their designs. The most common and important controlled impedance types we see include microstrip, stripline, embedded microstrip, and differential pairs.
Designers Notebook: Layer Stackup Planning for RF Circuit Boards
04/17/2025 | Vern Solberg -- Column: Designer's NotebookWhen designing multiple layer circuits requiring impedance control, the circuit board designer will work closely with an engineering specialist cognizant of RF printed circuit board design and layout, including mixed-signal applications.
Beyond Design: Key SI Considerations for High-speed PCB Design
03/20/2025 | Barry Olney -- Column: Beyond DesignOver the past two decades, I've simulated numerous complex, high-speed designs for customers creating computer-based products. In addition, I've conducted signal integrity software training courses and led classes on high-speed design. In this month’s column, I will reflect on the key considerations for achieving a successful high-speed PCB design that performs reliably, and I’ll highlight some of the common signal integrity issues that I frequently encounter.
Fresh PCB Concepts: PCB Stackup Strategies—Minimizing Crosstalk and EMI for Signal Integrity
01/09/2025 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are critical components in almost every modern electronic device, but their design goes far beyond routing signals from one point to another. The stackup of a PCB (the arrangement of its layers) has a significant impact on signal integrity, electromagnetic interference (EMI), and crosstalk. The complexity of these issues grows exponentially as designs increase in speed, frequency, and complexity.
Copyright © 2025 I-Connect007 / Global Electronics Association Publishing Group All rights reserved.
Log in