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The Legislative Outlook: Helping or Hurting?
This month, we examine the rules and laws shaping the current global business landscape and how these factors may open some doors but may also complicate business operations, making profitability more challenging.
Advancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
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Precision Back-drilling High-Speed PCBs? No Problem!
May 29, 2015 | Real Time with...IPCEstimated reading time: Less than a minute
Grant Christiansen of Schmoll Maschinen discusses the latest developments for high-speed back-drilling, particularly for the North American market. He stresses the importance of both software and machine capability, along with working closely with the customer.
Watch the interview here.
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Connect the Dots: Designing for the Reality of UHDI PCBs—Drilling
11/04/2025 | Matt Stevenson -- Column: Connect the DotsUltra high density interconnect (UHDI) PCBs are changing the game in designing for the reality of manufacturing. With both consumer and industrial electronic devices becoming more advanced, the demand for UHDI PCBs will grow. That means we’re all likely to be designing more UHDI boards. UHDI advanced miniaturization technology challenges designers with regard to both board thickness and footprint. Designers will face more variables in every aspect of design creation. This is certainly the case with drilling.
Driving Innovation: Mastering Panel Warpage
09/23/2025 | Simon Khesin -- Column: Driving InnovationDuring the complex and multi-step process of PCB fabrication, a panel's flatness is constantly at risk. A host of factors can introduce warpage, bending, and unevenness, presenting a fundamental challenge to achieving high-precision results. This deformation (sometimes referred to as “bow and twist”), even on a microscopic scale, can lead to critical defects during subsequent stages, such as component surface mounting (e.g., tombstoning, solder opens) and the PCB's long-term functional reliability.
New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect
09/08/2025 | I-Connect007In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.
New Episode Drop: MKS’ ESI’s Role in Optimize the Interconnect
08/26/2025 | I-Connect007In this latest episode, Casey Kruger, director of product marketing at MKS’ ESI, joins On the Line With… host Nolan Johnson to share how CO₂ laser technology delivers faster, more accurate vias in a smaller, more energy-efficient footprint.
New Podcast Episode Drop: Optimize the Interconnect and the Future of HDI
07/28/2025 | I-Connect007The Optimize the Interconnect podcast series continues with its second installment, featuring Chris Ryder, senior director of business development at MKS’ ESI. In this episode, Ryder shares compelling real-world examples that illustrate why Optimize the Interconnect is gaining traction across the industry.