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Suggested Items

Below the Surface: Why Thermal Failure Is Still the No. 1 Killer in Power Electronics

08/13/2026 | Chandra Gupta -- Column: Below the Surface
Why do power electronics fail? There’s a range of answers, from overvoltage and mechanical stress to poor assembly and environmental exposure. If you ask your favorite AI search engine for an answer, you’ll get a pretty simple response: excessive temperature leads to component degradation, material breakdown, and eventual failure. In a sense, that’s true, but it’s oversimplified and incomplete. The real issue is thermal management failure at the system level. Heat is still the number one killer, and most of the time, you don’t even realize it’s there.

Ventec’s Glass-Free Revolution: Smarter Material Data for Next-Gen PCB Designs

08/13/2026 | Ventec
At Ventec, we’re excited to see our Glass-Free Bondply materials now included in the latest release of Polar Instruments’ Speedstack.

A Practical Approach to Material Selection for High Power PCBs

08/13/2026 | Drew Delaney, Isola Group
With AI server architectures demanding high-power converter solutions to improve power efficiency and affordability, PCB design can challenge engineers who treat material selection as a single-variable problem. Pick a laminate for thermal conductivity, and you may experience a CTE mismatch that cracks vias after 50 thermal cycles. Optimize for dielectric loss, and you might sacrifice the isolation margin your certification depends on. High-power boards require consideration of multiple variables, including electrical, thermal, mechanical, reliability, and manufacturability, which cannot be optimized alone.

Understanding Design for Display Electronics

08/12/2026 | Marcy LaRont, I-Connect007 Magazine
For Kristin Moyer, designing display electronics is all about scale. As displays shrink in size and grow in resolution, every engineering decision becomes more demanding. In this interview, the Global Electronics Association design instructor explains the strengths and limitations of today’s dominant display technologies—LCD and LED—as well as the emerging role of AR/VR displays. Kristin also explores the PCB design, manufacturability, and reliability challenges that accompany each.

Advanced Packaging, Materials Characterization, and System Integration: What’s Ahead in the Advanced Electronics Packaging Digest

08/11/2026 | I-Connect007 Editorial Team
The August issue of Advanced Electronics Packaging Digest explores how advanced packaging is reshaping semiconductor innovation through better materials characterization, heterogeneous integration (HI), workforce education, and system-level design. Together, these features examine the technologies and engineering decisions driving the next generation of electronic systems.
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