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Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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EDA Analyst Gary Smith Dead at 74
July 8, 2015 | Andy Shaughnessy, PCBDesign007Estimated reading time: Less than a minute
Longtime EDA analyst Gary Smith died July 3 in Flagstaff, Arizona at the age of 74. He had been ill with pneumonia. He is survived by his wife, Lori Kate, his son, Casey, and granddaughters Rachel and Shannon.
Gary worked at Dataquest from 1994 to 2006, and later founded Gary Smith EDA. He knew more about the EDA market than anyone I’ve ever known.
I once asked Gary, “How many PCB design seats do you think are in China?” He sent me numbers for all of Asia and broke them down by country. He really loved EDA.
Gary was also a great bass player. He was a member of the Full Disclosure blues band, whose members included Synopsys CEO Aart DeGeus and Sonics CEO Grant Pierce. I was fortunate enough to play with him a few times when he jammed with the Porch Dawgs at the Design Automation Conferences. He will be missed.
A memorial service is set for Sunday, July 12 at 11 am at the DoubleTree San Jose in San Jose, California.
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I-Connect007 Magazine: APEX EXPO 2026 Preview Plus AI Tools Designers Are Watching
02/17/2026 | I-Connect007 Editorial TeamThis month, I-Connect007 Magazine takes you inside APEX EXPO 2026, highlighting exhibitors and special events on the show floor, insights from the technical conference, updates on apprenticeships and keynotes, and progress in critical standards development. For PCB designers, we go beyond the dreaded auto-router, diving into practical AI-driven design tools that are actually shaping real-world workflows.
Cadence Launches ChipStack AI Super Agent for Next-Gen Chip Design
02/16/2026 | Cadence Design SystemsCadence announced a transformative step forward in redefining how semiconductors are designed with the launch of the ChipStack™ AI Super Agent—an agentic AI solution for front-end silicon design and verification.
American Standard Circuits Manufactures IC Substrate Designs Featuring 5–7 Stacked Microvias
02/13/2026 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading U.S. manufacturer of advanced printed circuit board solutions, has successfully manufactured and shipped multiple IC substrate designs incorporating 5 to 7 stacked microvias using the company’s advanced Ultra High Density Interconnect (UHDI) manufacturing platform.
Astera Labs Opens Israel Design Center to Boost AI Connectivity Expansion
02/13/2026 | Astera Labs, Inc.Astera Labs, Inc., a leader in semiconductor-based connectivity solutions for rack-scale AI infrastructure, announced a significant expansion of its global engineering operations with the establishment of an advanced research and development center in Israel.