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Polar Instruments: Si and Speedstack Projects Now ShippingJuly 27, 2015 | Polar Instruments
Estimated reading time: Less than a minute
Polar Instruments is delighted to announce that Projects option is now available in Speedstack PCB, Speedstack Si, Si8000m and Si9000e layer stackup, impedance & insertion loss design tools. Projects allows groups of structures to be saved and recalled in Si8000m and Si9000e and entire stackups of structures to be pasted from Speedstack into Si8000m and Si9000e with just a few clicks of the mouse.
As a reminder of the projects' capabilities, click here.
Projects is a cost option – however existing customers may upgrade to benefit from Projects capability at no cost as a concession provided Polarcare remains active.
One last note – the 2015 releases of Si8000m and Si9000e also add a “copy structure parameters” – This lets you copy all the relevant geometric structure information from for example a coated to an uncoated structure – or a single ended to a differential pair – it offers significant time savings when making comparisons.
The problem at the moment is that sensors are currently manufactured on a tiny sliver of silicon, or die, by a small number of specialist companies with each sensor type being produced on a dedicated production line so it is hard to ramp up production.
Gartner, Inc. highlighted five technologies that will transform the digital future of organizations. They include digital humans, satellite communications, tiny ambient IoT, secure computation and autonomic robots.
Though cost pressures continue to impact the electronics industry, product demand and inventories remain positive, leading to a healthy supply chain per IPC’s August 2023 Global Sentiment of the Electronics Supply Chain Report.
Signal integrity (SI) and power integrity (PI) are top priorities for engineers designing today’s high-speed, high-density circuit boards, and faster signoff of designs can be achieved by uncovering SI/PI issues early in the design process, before costly respins are required. Three key issues engineers need to overcome to sign off on high-speed PCB designs include power analysis, serializer/deserializer (SerDes) link compliance, and double data rate (DDR) memory interface compliance.
Dr. Tim Rodgers might not call himself a “business strategies guru,” but the moniker certainly fits. As an adjunct faculty instructor at the University of Colorado, Tim specializes in project management, problem-solving, and streamlining processes in engineering and manufacturing. Plus, Tim knows the business side of PCB fabrication. We asked Tim to discuss the process of developing a successful business strategy for PCB fabricators, why operational efficiency is not a strategy itself, and how smaller companies can differentiate themselves in an industry that’s becoming more and more commoditized.