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Polar Instruments Launches New Language Versions of The Speedstack PCB Layer Stackup Design System
August 18, 2015 | Polar InstrumentsEstimated reading time: 1 minute
Key Facts:
- Accurate PCB stackup data can be shared between OEM designers and
 - PCB fabricators in the local language of key markets
 - Increases the ease of use for customers in Germany, Japan and China
 - Exports stackup documentation in a range of industry-standard formats
 - Supports fast optimisation of PCB costs and manufacturing yields
 - Consistent communication throughout the supply chain
 
Polar Instruments - a specialist provider of tools for high speed PCB design, fabrication and test - has launched new language versions of Speedstack, the industry’s best-selling PCB layer stackup design system. In addition to English, Speedstack is now available in German, Japanese, simplified Chinese and traditional Chinese versions.
“Customer demand was a strong factor in our decision to offer Speedstack in multiple language versions,” explains Martyn Gaudion, CEO of Polar Instruments. “One of the key strengths of the Speedstack system is its ability to accurately document detailed specifications for each layer in a PCB stackup. Providing OEM designers and PCB fabricators with the ability to share these specifications in their local language further enhances the speed and ease of using the Speedstack system for PCB stackup design.”
Speedstack is already licensed with OEM designers, PCB technologists and PCB fabricators worldwide, providing an ultra-fast process for creating and accurately documenting stackups for High-Density Interconnect (HDI) and flex-rigid PCBs. The system also allows PCB fabricators to fine-tune the stackup design by assessing the impact of different PCB materials on cost, performance and manufacturing yield. The accurate stackup data generated by Speedstack can be exported in different industry-standard formats and shared with companies throughout the PCB supply-chain.
About Polar Instruments
Polar Instruments is a market leader in design and manufacturing tools to simplify and enhance the design, fabrication and testing of printed circuit boards (PCBs). Their innovative tools include the industry-standard Controlled Impedance Test System (CITS) which provides the global PCB industry with an easy-to-use test system for high-speed digital and RF boards, as well as class-leading tools for fast and accurate design and testing of controlled impedance in PCBs. Polar also leads the industry in tools for automated PCB layer stackup design and documentation. Polar Instruments was established in 1976 and has offices and branded operations in the US, UK, Europe and Asia Pacific. www.polarinstruments.com
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Real Time with... SMTAI 2025: Navigating Manufacturing Challenges with Akrometrix
11/03/2025 | Real Time with...SMTAIMarcy LaRont and Paul Handler of Aktrometrix share insights from the SMTAI show in Chicago. They address manufacturing challenges, particularly warpage issues, and discuss Akrometrix's solutions. Paul details three optical technologies for measuring warpage and thermal expansion, emphasizing the need for reliability and defect detection in production. The conversation also touches on new industry standards for board warpage, influenced by OEMs.
I-Connect007 Welcomes New Columnist: Leo Lambert, EPTAC
10/30/2025 | I-Connect007I-Connect007 is excited to announce a column by Leo Lambert, an industry veteran with 40 years of experience, an award winner, and technical director at EPTAC. This column, Learning With Leo, will explore the evolution and related challenges of electronics product assembly, especially as it relates to training.
Better Sustainability Policies for Electronics
10/29/2025 | Diana Radovan, Global Electronics AssociationI joined the Global Electronics Association in August 2025 as the director of sustainability policy. Since then, much has happened in terms of geopolitics and in the development and re-envisioning of sustainability policies in the industry. While the European Commission has released several legislative packages to simplify sustainability requirements (“omnibus”), these developments haven’t yet settled and are not in effect. Given the many recent and ongoing public consultations, with often conflicting input from a broad range of stakeholders, final negotiations remain rather polarized among policymakers.