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Current IssueRigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
Simulation, Analysis, and AI
Getting today’s designs “right the first time” is critical, especially with costly advanced PCBs. Simulation and analysis software tools can help you in the fight to eliminate respins. They’re not magical, but they can predict the future of your design.
Advanced, Complex & Emerging Designs
This month, our contributors focus on designing PCBs with advanced, complex and emerging technologies. We investigate design strategies for boards that are on the cutting edge of technology, or crazily complex, or so new that designers are still writing the rules as they go.
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Register Now for DesignCon’s Early Bird Pricing
August 26, 2015 | DesignCon 2016Estimated reading time: Less than a minute
DesignCon 2016 is offering more than 100 technical paper sessions, panels and tutorials covering signal integrity, power integrity, jitter, crosstalk, test and measurement, parallel and memory interface design, ICs, semiconductor components and more.
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Suggested Items
Challenges in Modern PCB Design and Analysis
09/05/2023 | Steve Watt, ZukenZuken recognizes the need to address innovation in all areas of the design process while remaining responsive to customer-driven requirements. While we can make predictions about various challenges, concerns, and requirements, our customers play a vital role in shaping the company’s development direction. They have the benefit of being “in the trenches,” so to speak, on a daily basis, so they are the subject matter experts and can help identify gaps in our tools based on where their processes are heading.
A Pilot Program Soars in Mexico
08/23/2023 | Michelle Te, I-Connect007With plants in Tijuana and Guadalajara, Mexico, that staff more than 3,000 employees, Benchmark Electronics has a continual need for training and certification to stay competitive. Through a unique partnership with IPC, the company was able to train nearly 100 operators and engineers through a pilot program that saved them money and elevated the knowledge base of their workforce. In this interview, Elizabeth Magana, a regional human resources director for Benchmark, Lorena Villanueva, IPC director of Mexico, and Carlos Plaza, IPC senior director of education development, detail the pilot program and how it serves as an example of training success in electronics manufacturing
The Big Picture: Essential Engineering—The Intersection of Humans and Machines
08/31/2023 | Mehul Davé -- Column: The Big PictureWhile quality engineering is dependent on high-end technology, machines, and data sets, it is essential for companies to prioritize the expertise, innovation, and critical discernment of its people—the engineers themselves. It is the engineering team that designs and drives the vehicle of production, not the other way around. Because they are inextricably linked, humans must understand and leverage machines to engineer the best possible products and free themselves to do the essential work machines are not capable of doing.
Intel, Lenovo Open Co-Engineering Lab in Shanghai
08/08/2023 | IntelEvery week, Zheng Jiong (ZJ), Intel China’s senior director of Client Customer Engineering in the Client Computing Group (CCG), and his team of engineers make the hourlong drive across Shanghai to meet with their counterparts at Lenovo.
Keysight Introduces High Density Source Measure Unit to Speed Semiconductor Characterization
07/17/2023 | Keysight Technologies, Inc.Keysight Technologies, Inc. introduces the PZ2100 Series High-Channel Density Precision Source Measure Unit (SMU) Solution, a new SMU solution giving digital development engineers 20 precision SMU channels within a 1U rack space to speed the characterization of integrated circuit (IC) designs.