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Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC

05/16/2024 | Indium Corporation
Indium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.

Indium Experts to Present at Electronics in Harsh Environments SMTA Conference

05/13/2024 | Indium Corporation
ndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.

Connect the Dots: Designing for Reality—The Pre-Manufacturing Process

05/08/2024 | Matt Stevenson -- Column: Connect the Dots
I have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.

AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea

05/08/2024 | AIM Solder
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.

Indium Corporation to Showcase HIA Materials at ECTC

05/07/2024 | Indium Corporation
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
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