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Navigating the Global Materials Supply Chain: A Roundtable Discussion
December 3, 2015 | Andy Shaughnessy, I-Connect007Estimated reading time: 15 minutes
At SMTAI recently, I sat down for a roundtable discussion with some key players from the materials side of the supply chain. Participants included two executives from Ventec: Mark Goodwin, COO USA and Europe for Ventec International Group, responsible for all non-agent activity and the supply, distribution and service centers in the U.S. and Europe; and Jack Pattie, president of Ventec USA and as such, manager of North American operations for the distribution of laminate and pre-preg. Also participating in the roundtable were Schoeller Electronics CEO Michael Keuthen, head of the Germany-based company that has been producing PCBs for more than 50 years and specializes in rigid-flex and flex activities, and Bob Willis, from the National Physics Laboratory (NPL), known worldwide for measuring standards. In a wide-ranging chat, we discussed the demands and challenges of the materials supply chain and where they see their industry going in the future.
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Electronics Industry Warns Mexico Tariffs Could Undercut U.S. Manufacturing and Supply Chain Resilience
10/24/2025 | Global Electronics AssociationAs negotiations over U.S.–Mexico trade policies near an October 29 deadline, the Global Electronics Association released a new policy brief, From Risk to Resilience: Why Mexico Matters to U.S. Manufacturing.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
New Course Presents a Comprehensive Guide to IPC Standards
10/10/2025 | Marcy LaRont, I-Connect007Francisco Fourcade, electronics technology standards manager for the Global Electronics Association, has spent years helping companies understand and implement the standards that keep the electronics manufacturing industry moving forward. In this interview, he shares updates on ongoing standards development efforts and previews a new course, "IPC Standards: A Guide for the Electronics Industry,” which starts Oct. 14.
North American EMS Industry Shipments Down 1.4% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.
North American PCB Industry Sales Up 12.8% in August
10/02/2025 | Global Electronics AssociationThe Global Electronics Association announced the August 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.98.