-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueTraining New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Check Back Next Week for Coverage of DesignCon 2016
January 13, 2016 | Andy Shaughnessy, PCBDesign007Estimated reading time: Less than a minute
If you can't make it to DesignCon 2016 next week, don't worry. PCBDesign007 will be there. DesignCon draws the movers and shakers of the PCB, chip, and systems design worlds each year, and we'll be covering this annual Silicon Valley event from start to finish.
Suggested Items
Compal Reports December 2024 Consolidated Revenue
01/10/2025 | Compal Electronics Inc.Compal Electronics, Inc. reported consolidated revenue of NT$64,057 million for December 2024, representing a month-over-month decrease of 19.6% and a year-over-year decrease of 7.9%.
GlobalFoundries, IBM Announce Settlement and Resolution of All Litigation Matters
01/03/2025 | GlobalFoundriesGlobalFoundries (GF) and IBM announced that the two companies have reached a settlement in their ongoing lawsuits, resolving all litigation matters, inclusive of breach of contract, trade secrets and intellectual property claims between the two companies.
Spotlight on PEDC: Filbert Arzola
12/19/2024 | Andy Shaughnessy, Design007 MagazineIPC and FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30 at the NH Danube City hotel in Vienna. Raytheon’s Filbert Arzola is presenting “Engineering and Adapting Model-based PCB Design in Step with Sustainability and Digital Twins” at PEDC. I asked Filbert to discuss what attendees can expect from his class.
Elementary Mr. Watson: How to Reinvent Your Professional Journey
12/18/2024 | John Watson -- Column: Elementary, Mr. WatsonThe end of the year is the perfect time to reflect and embrace the significance of this moment. This season is not simply a milestone marking the end of one chapter and the beginning of another; it’s an opportunity to acknowledge our journey and appreciate the lessons we’ve learned, the challenges we’ve overcome, and the people who have supported us.
The New Chapter: The Benefits of Continuing Education
12/19/2024 | Hannah Grace & Paige Fiet -- Column: The New ChapterAfter more than four grueling years of engineering school, I never wanted to see the inside of a classroom again. That might seem melodramatic, but it’s exactly how I felt on graduation day. Then, I was too overwhelmed with a move across the country and the start of a new job to worry about furthering my education.